K6F2016R4G-XF850 datasheet, PDF

K6F2016R4G-XF850: DescriptionStandard SRAM, 128KX16, 80ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, LEAD FREE, FBGA-48; Categorystorage storage; File Size161KB，10 Pages; ManufacturerSAMSUNG; Websitehttp://www.samsung.com/Products/Semiconductor/; Environmental Compliance

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K6F2016R4G-XF850 Overview

Standard SRAM, 128KX16, 80ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, LEAD FREE, FBGA-48

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SAMSUNG
Parts packaging code	BGA
package instruction	VFBGA,
Contacts	48
Reach Compliance Code	compliant
ECCN code	3A991.B.2.A
Maximum access time	80 ns
JESD-30 code	R-PBGA-B48
JESD-609 code	e1
length	7 mm
memory density	2097152 bit
Memory IC Type	STANDARD SRAM
memory width	16
Humidity sensitivity level	2
Number of functions	1
Number of terminals	48
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	128KX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.65 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.75 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
width	6 mm

Preliminary

K6F2016R4G Family

CMOS SRAM

2Mb(128K x 16 bit) Low Power SRAM

INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,

AND IS SUBJECT TO CHANGE WITHOUT NOTICE.

NOTHING IN THIS DOCUMENT SHALL BE CONSTRUED AS GRANTING ANY LICENSE,

EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROP-

ERTY RIGHTS IN SAMSUNG PRODUCTS OR TECHNOLOGY.

ALL INFORMATION IN THIS DOCUMENT IS PROVIDED ON AS "AS IS" BASIS WITHOUT

GUARANTEE OR WARRANTY OF ANY KIND.

1. For updates or additional information about Samsung products, contact your nearest Samsung office.

2. Samsung products are not intended for use in life support, critical care, medical, safety equipment, or simi-

lar applications where Product failure could result in loss of life or personal or physical harm, or any military

or defense application, or any governmental procurement to which special terms or provisions may apply.

* Samsung Electronics reserves the right to change products or specification without notice.

-1-

Revision 0.0

April 2005

	K6F2016R4G-XF850	K6F2016R4G-FF850
Description	Standard SRAM, 128KX16, 80ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, LEAD FREE, FBGA-48	Standard SRAM, 128KX16, 80ns, CMOS, PBGA48, 6 X 7 MM, 0.75 MM PITCH, FBGA-48
Is it Rohs certified?	conform to	incompatible
Maker	SAMSUNG	SAMSUNG
Parts packaging code	BGA	BGA
package instruction	VFBGA,	VFBGA,
Contacts	48	48
Reach Compliance Code	compliant	compli
ECCN code	3A991.B.2.A	3A991.B.2.A
Maximum access time	80 ns	80 ns
JESD-30 code	R-PBGA-B48	R-PBGA-B48
length	7 mm	7 mm
memory density	2097152 bit	2097152 bi
Memory IC Type	STANDARD SRAM	STANDARD SRAM
memory width	16	16
Number of functions	1	1
Number of terminals	48	48
word count	131072 words	131072 words
character code	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
organize	128KX16	128KX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	240
Certification status	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm
Maximum supply voltage (Vsup)	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.65 V	1.65 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V
surface mount	YES	YES
technology	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal form	BALL	BALL
Terminal pitch	0.75 mm	0.75 mm
Terminal location	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	30
width	6 mm	6 mm

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