Standard SRAM, 256KX32, 20ns, CMOS, PZIP64,
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Integrated Silicon Solution ( ISSI ) |
Reach Compliance Code | compliant |
Maximum access time | 20 ns |
I/O type | COMMON |
JESD-30 code | R-PZIP-T64 |
JESD-609 code | e0 |
memory density | 8388608 bit |
Memory IC Type | STANDARD SRAM |
memory width | 32 |
Number of terminals | 64 |
word count | 262144 words |
character code | 256000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX32 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | ZIP |
Encapsulate equivalent code | ZIP64/68,.1,.1 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 15.494 mm |
Maximum standby current | 0.04 A |
Minimum standby current | 4.5 V |
Maximum slew rate | 1.12 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 1.27 mm |
Terminal location | ZIG-ZAG |
AP32M256Z-20 | AP32M256Z-25 | AP32M256M-25 | AP32M256M7-15 | AP32M256M-15 | AP32M256Z-15 | AP32M256M-20 | AP32M256M7-20 | AP32M256M7-25 | |
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Description | Standard SRAM, 256KX32, 20ns, CMOS, PZIP64, | Standard SRAM, 256KX32, 25ns, CMOS, PZIP64, | Standard SRAM, 256KX32, 25ns, CMOS, SIMM-64 | Standard SRAM, 256KX32, 15ns, CMOS, SIMM-72 | Standard SRAM, 256KX32, 15ns, CMOS, SIMM-64 | Standard SRAM, 256KX32, 15ns, CMOS, PZIP64, | Standard SRAM, 256KX32, 20ns, CMOS, SIMM-64 | Standard SRAM, 256KX32, 20ns, CMOS, SIMM-72 | Standard SRAM, 256KX32, 25ns, CMOS, SIMM-72 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
Maximum access time | 20 ns | 25 ns | 25 ns | 15 ns | 15 ns | 15 ns | 20 ns | 20 ns | 25 ns |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-PZIP-T64 | R-PZIP-T64 | R-XSMA-N64 | R-XSMA-N72 | R-XSMA-N64 | R-PZIP-T64 | R-XSMA-N64 | R-XSMA-N72 | R-XSMA-N72 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit | 8388608 bit |
Memory IC Type | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Number of terminals | 64 | 64 | 64 | 72 | 64 | 64 | 64 | 72 | 72 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 | 256KX32 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | ZIP | ZIP | SIMM | SIMM | SIMM | ZIP | SIMM | SIMM | SIMM |
Encapsulate equivalent code | ZIP64/68,.1,.1 | ZIP64/68,.1,.1 | SSIM64 | SSIM72 | SSIM64 | ZIP64/68,.1,.1 | SSIM64 | SSIM72 | SSIM72 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 15.494 mm | 15.494 mm | 15.11 mm | 15.113 mm | 15.11 mm | 15.494 mm | 15.11 mm | 15.113 mm | 15.113 mm |
Maximum standby current | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A | 0.04 A |
Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Maximum slew rate | 1.12 mA | 0.96 mA | 0.96 mA | 1.28 mA | 1.28 mA | 1.28 mA | 1.12 mA | 1.12 mA | 0.96 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | ZIG-ZAG | ZIG-ZAG | SINGLE | SINGLE | SINGLE | ZIG-ZAG | SINGLE | SINGLE | SINGLE |
Maker | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
package instruction | - | - | SIMM-64 | SIMM-72 | SIMM-64 | - | SIMM-64 | SIMM-72 | SIMM-72 |
Other features | - | - | WD-MAX | LG-MAX; WD-MAX | WD-MAX | - | WD-MAX | LG-MAX; WD-MAX | LG-MAX; WD-MAX |
length | - | - | 97.79 mm | 108.077 mm | 97.79 mm | - | 97.79 mm | 108.077 mm | 108.077 mm |
Number of functions | - | - | 1 | 1 | 1 | - | 1 | 1 | 1 |
Maximum supply voltage (Vsup) | - | - | 5.5 V | 5.5 V | 5.5 V | - | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | - | - | 4.5 V | 4.5 V | 4.5 V | - | 4.5 V | 4.5 V | 4.5 V |
width | - | - | 8.89 mm | 8.89 mm | 8.89 mm | - | 8.89 mm | 8.89 mm | 8.89 mm |