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MPC755BZT350TD

Description
32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size512KB,2 Pages
ManufacturerMotorola ( NXP )
Websitehttps://www.nxp.com
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MPC755BZT350TD Overview

32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360

MPC755BZT350TD Parametric

Parameter NameAttribute value
MakerMotorola ( NXP )
Parts packaging codeBGA
package instructionBGA,
Contacts360
Reach Compliance Codeunknown
Address bus width32
bit size32
boundary scanNO
External data bus width64
FormatFLOATING POINT
Integrated cacheYES
JESD-30 codeS-PBGA-B360
low power modeYES
Number of terminals360
Maximum operating temperature105 °C
Minimum operating temperature-40 °C
Package body materialPLASTIC/EPOXY
encapsulated codeBGA
Package shapeSQUARE
Package formGRID ARRAY
Certification statusNot Qualified
speed350 MHz
Nominal supply voltage2 V
surface mountYES
technologyCMOS
Temperature levelINDUSTRIAL
Terminal formBALL
Terminal locationBOTTOM
uPs/uCs/peripheral integrated circuit typeMICROPROCESSOR, RISC

MPC755BZT350TD Related Products

MPC755BZT350TD MPC755BZT300TD MPC755BPX400LD MPC745BPX350RD MPC755BPX350RD MPC755BPX350TD MPC745BZT350TD MPC755BZT400LD
Description 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 32-BIT, 300MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 32-BIT, 350MHz, RISC PROCESSOR, PBGA255, PLASTIC, BGA-255 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360 32-BIT, 350MHz, RISC PROCESSOR, PBGA255, PLASTIC, BGA-255 32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360
Maker Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
Parts packaging code BGA BGA BGA BGA BGA BGA BGA BGA
package instruction BGA, BGA, BGA, BGA, BGA, BGA, BGA, BGA,
Contacts 360 360 360 255 360 360 255 360
Reach Compliance Code unknown unknown unknown unknown unknown unknow unknow unknow
Address bus width 32 32 32 32 32 32 32 32
bit size 32 32 32 32 32 32 32 32
boundary scan NO NO NO NO NO NO NO NO
External data bus width 64 64 64 64 64 64 64 64
Format FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT FLOATING POINT
Integrated cache YES YES YES YES YES YES YES YES
JESD-30 code S-PBGA-B360 S-PBGA-B360 S-PBGA-B360 S-PBGA-B255 S-PBGA-B360 S-PBGA-B360 S-PBGA-B255 S-PBGA-B360
low power mode YES YES YES YES YES YES YES YES
Number of terminals 360 360 360 255 360 360 255 360
Package body material PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
encapsulated code BGA BGA BGA BGA BGA BGA BGA BGA
Package shape SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE SQUARE
Package form GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY GRID ARRAY
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
speed 350 MHz 300 MHz 400 MHz 350 MHz 350 MHz 350 MHz 350 MHz 400 MHz
Nominal supply voltage 2 V 2 V 2 V 2 V 2 V 2 V 2 V 2 V
surface mount YES YES YES YES YES YES YES YES
technology CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
Terminal form BALL BALL BALL BALL BALL BALL BALL BALL
Terminal location BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM BOTTOM
uPs/uCs/peripheral integrated circuit type MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC MICROPROCESSOR, RISC
Maximum operating temperature 105 °C 105 °C - 105 °C 105 °C 105 °C 105 °C -

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