MPC755BZT300TD datasheet, PDF - EEWORLD Datasheet

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MPC755BZT300TD: Description32-BIT, 300MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360; CategoryThe embedded processor and controller Microcontrollers and processors; File Size512KB，2 Pages; ManufacturerMotorola ( NXP ); Websitehttps://www.nxp.com

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MPC755BZT300TD Overview

32-BIT, 300MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360

MPC755BZT300TD Parametric

Parameter Name	Attribute value
Maker	Motorola ( NXP )
Parts packaging code	BGA
package instruction	BGA,
Contacts	360
Reach Compliance Code	unknown
Address bus width	32
bit size	32
boundary scan	NO
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-PBGA-B360
low power mode	YES
Number of terminals	360
Maximum operating temperature	105 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
speed	300 MHz
Nominal supply voltage	2 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal form	BALL
Terminal location	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

MPC755BZT300TD Related Products

	MPC755BZT300TD	MPC755BZT350TD	MPC755BPX400LD	MPC745BPX350RD	MPC755BPX350RD	MPC755BPX350TD	MPC745BZT350TD	MPC755BZT400LD
Description	32-BIT, 300MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 350MHz, RISC PROCESSOR, PBGA255, PLASTIC, BGA-255	32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 350MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360	32-BIT, 350MHz, RISC PROCESSOR, PBGA255, PLASTIC, BGA-255	32-BIT, 400MHz, RISC PROCESSOR, PBGA360, PLASTIC, BGA-360
Maker	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )	Motorola ( NXP )
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	360	360	360	255	360	360	255	360
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknow	unknow	unknow
Address bus width	32	32	32	32	32	32	32	32
bit size	32	32	32	32	32	32	32	32
boundary scan	NO	NO	NO	NO	NO	NO	NO	NO
External data bus width	64	64	64	64	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-PBGA-B360	S-PBGA-B360	S-PBGA-B360	S-PBGA-B255	S-PBGA-B360	S-PBGA-B360	S-PBGA-B255	S-PBGA-B360
low power mode	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	360	360	360	255	360	360	255	360
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
speed	300 MHz	350 MHz	400 MHz	350 MHz	350 MHz	350 MHz	350 MHz	400 MHz
Nominal supply voltage	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC
Maximum operating temperature	105 °C	105 °C	-	105 °C	105 °C	105 °C	105 °C	-

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