3A at T = 55 C WITH NO THERMAL RUNAWAY
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES
LOW FORWARD VOLTAGE DROP
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM
MECHANICAL STRENGTH AND HEAT DISSIPATION
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)
PROPRIETARY
SOFT GLASS
JUNCTION
PASSIVATION FOR SUPERIOR RELIABILITY AND
PERFORMANCE
PARAMETER (TEST CONDITIONS)
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: (310) 767-1052 Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
MECHANICAL DATA
3 AMP HIGH RELIABILITY FAST RECOVERY DIODES
FEATURES
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS
R
R
oHS
T
IAN
L
MP
CO
ACTUAL SIZE OF
DO-27 PACKAGE
SYMBOL
MECHANICAL SPECIFICATION
DO - 27
Sym
LL
LD
BD
BL
RATINGS
Data Sheet No. FSPD-300-1B
Color Band
Denotes
Cathode
LD (Dia)
BD (Dia)
1.00
0.048
Minimum
In
mm
SERIES RGP300 - RGP310
25.4
1.2
0.205
Maximum
In
mm
9.28
0.365
0.052
UNITS
1.3
5.2
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FIGURE 2. MAXIMUM NON-REPETITIVE SURGE CURRENT
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FIGURE 1. FORWARD CURRENT DERATING CURVE
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0.01
0.4
0.1
18020 Hobart Blvd., Unit B
Gardena, CA 90248 U.S.A
Tel.: (310) 767-1052 Fax: (310) 767-7958
DIOTEC ELECTRONICS CORP.
0.6
3 AMP HIGH RELIABILITY FAST RECOVERY DIODES
RATING & CHARACTERISTIC CURVES FOR SERIES RGP300 - RGP310
0.8
1.0
1.2
1.4
1.6
1.8
¢
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FIGURE 5. REVERSE RECOVERY TEST SETUP AND TIME CHARACTERISTIC
FIGURE 4. TYPICAL JUNCTION CAPACITANCE
T
J
= 25
o
C
Ý Ý Ü Û Ú ØÙ × Ö Õ Ô Ó
Data Sheet No. FSPD-300--2B