SRAM Module, 256KX8, 85ns, CMOS,
| Parameter Name | Attribute value |
| Maker | EDI [Electronic devices inc.] |
| Reach Compliance Code | unknown |
| Maximum access time | 85 ns |
| JESD-30 code | R-XDMA-G32 |
| memory density | 2097152 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of ports | 1 |
| Number of terminals | 32 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 256KX8 |
| Output characteristics | 3-STATE |
| Exportable | YES |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal form | GULL WING |
| Terminal location | DUAL |
| EDI8F8257P85BPI | EDI8F8257P150BPI | EDI8F8257P100BPI | EDI8F8257P120BPI | |
|---|---|---|---|---|
| Description | SRAM Module, 256KX8, 85ns, CMOS, | SRAM Module, 256KX8, 150ns, CMOS, | SRAM Module, 256KX8, 100ns, CMOS, | SRAM Module, 256KX8, 120ns, CMOS, |
| Reach Compliance Code | unknown | unknown | unknown | unknown |
| Maximum access time | 85 ns | 150 ns | 100 ns | 120 ns |
| JESD-30 code | R-XDMA-G32 | R-XDMA-G32 | R-XDMA-G32 | R-XDMA-G32 |
| memory density | 2097152 bit | 2097152 bit | 2097152 bit | 2097152 bit |
| Memory IC Type | SRAM MODULE | SRAM MODULE | SRAM MODULE | SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of ports | 1 | 1 | 1 | 1 |
| Number of terminals | 32 | 32 | 32 | 32 |
| word count | 262144 words | 262144 words | 262144 words | 262144 words |
| character code | 256000 | 256000 | 256000 | 256000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C | 85 °C | 85 °C | 85 °C |
| Minimum operating temperature | -40 °C | -40 °C | -40 °C | -40 °C |
| organize | 256KX8 | 256KX8 | 256KX8 | 256KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Exportable | YES | YES | YES | YES |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | YES | YES | YES | YES |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| Terminal form | GULL WING | GULL WING | GULL WING | GULL WING |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maker | EDI [Electronic devices inc.] | EDI [Electronic devices inc.] | - | EDI [Electronic devices inc.] |
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