PHC Holtite Series
®
Zero Profile Mylar Carrier PGA Sockets
®
FEATURES:
PERFORMANCE SPECIFICATIONS:
MECHANICAL
Vibration ........................ Passed MIL-STD-202, Method 204, 20 G’s
Durabilty ........................ Passed MIL-STD-1344, Method 2016, 50 cycles
Solderability .................. Passed MIL-STD-202F, Method 208
Insertion Force (5P) ...... 92 Grams (3.2 oz.) average with .018" (0,46) dia.
pol. steel pin and .043" (1,09) plated thru hole
Withdrawal Force (5P) .. 103 Grams (3.6 oz.) average with .018" (0,46) dia.
pol. steel pin and .043" (1,09) plated thru hole
Contact Retention
in Board ...................... 7.5 Lbs. per line average
ELECTRICAL
Contact Resistance ........ 10 Milliohms
Contact Rating .............. 3 Amps
ENVIRONMENTAL
Humidity ........................ Passed MIL-STD-202, Method 106
Thermal Shock .............. Passed MIL-STD-202, Method 107, Cond. F
Operation Temperature .. Gold inner contact -55°C to +125°C,
Tin/lead inner contact -55°C to +105°C
Insertion Force (27P) .... 57 Grams (2.2 oz.) average with .018" (0,46) dia.
pol. steel pin and a .039" (0,99) plated thru hole
Withdrawal Force(27P) 30 Grams (1.1 oz.) average with .018" (0,46) dia.
pol. steel pin and a .039" (0,99) plated thru hole
For performance specifications on 6P Holtites
®
, please consult factory
E
The PHC Series of Holtite
®
Zero Profile pin grid solderless sockets are
designed to press fit into the plated through hole of a printed wiring board.
This unique design allows the plated through hole to become the component
socket. The elimination of soldering and insulator material gives the lowest
mounting profile possible for the pin grid array and the maximum visibility
to the circuit traces on the PCB for inspection and testing purposes.
• Low insertion and withdrawal force contacts available
• The profile of the printed wiring board with the Holtite
®
contact installed
offers the lowest socketing profile, permitting card rack spacing as low
as .400" (10,16)
• Precision machined, tapered entry, four-finger contact
• Retains minimum component lead lengths
• Maximum heat dissipation
• Removes artwork design restrictions
• Immediate conversion to the Holtite
®
system
MATERIAL SPECIFICATIONS:
Carrier ............................ Mylar
®
Contact .......................... Beryllium copper
Plating ............................ Gold or tin/lead
HOW TO ORDER
PHC
Number of
Contacts
Plating Options
2
- Gold
3
- Tin/Lead
Holtite
Selection
(Table 1)
Grid size
Footprint
Options
(Pg. D23)
H
Part Number Example:
PHC068-2E1333-H
Quality & Innovation From The
Product Group
E2
Thomas & Betts
1555 Lynnfield Road
Memphis, TN 38119
(901) 682-8221 FAX (901) 537-8805
Innovation Lab
京公网安备 11010802033920号
EEWORLD
