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MIMX8MN3DVTJZAA

Description
Multifunction Peripheral
CategoryThe embedded processor and controller    Microcontrollers and processors   
File Size2MB,89 Pages
ManufacturerNXP
Websitehttps://www.nxp.com
Environmental Compliance
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MIMX8MN3DVTJZAA Overview

Multifunction Peripheral

MIMX8MN3DVTJZAA Parametric

Parameter NameAttribute value
Is it Rohs certified?conform to
MakerNXP
package instruction,
Reach Compliance Codeunknown
Humidity sensitivity level3
Peak Reflow Temperature (Celsius)260
Maximum time at peak reflow temperature40
NXP Semiconductors
Data Sheet: Technical Data
Document Number: IMX8MNCEC
Rev. 0, 10/2019
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MIMX8MN2DVTJZAA
MIMX8MN6DVTJZCA
MIMX8MN5DVTJZAA
MIMX8MN3DVTJZAA
MIMX8MN1DVTJZAA
i.MX 8M Nano
Applications Processor
Datasheet for Consumer
Products
Package Information
Plastic Package
FCBGA 14 x 14 mm, 0.5 mm pitch
Ordering Information
See
Table 2 on page 6
1
i.MX 8M Nano introduction
1. i.MX 8M Nano introduction . . . . . . . . . . . . . . . . . . . . . . . 1
1.1. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.2. Ordering information . . . . . . . . . . . . . . . . . . . . . . . 6
2. Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
2.1. Recommended connections for unused input/output
12
3. Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . 14
3.1. Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . 14
3.2. Power supplies requirements and restrictions . . . 22
3.3. PLL electrical characteristics . . . . . . . . . . . . . . . . 26
3.4. On-chip oscillators . . . . . . . . . . . . . . . . . . . . . . . . 28
3.6. I/O AC parameters . . . . . . . . . . . . . . . . . . . . . . . 29
3.7. Output buffer impedance parameters . . . . . . . . . 31
3.8. System modules timing . . . . . . . . . . . . . . . . . . . . 33
3.9. External peripheral interface parameters . . . . . . 34
4. Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 68
4.1. Boot mode configuration pins . . . . . . . . . . . . . . . 68
4.2. Boot device interface allocation . . . . . . . . . . . . . . 68
5. Package information and contact assignments . . . . . . . 70
5.1. 14 x 14 mm package information . . . . . . . . . . . . 70
5.2. DDR pin function list . . . . . . . . . . . . . . . . . . . . . . 85
6. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
The i.MX 8M Nano application processor represents
NXP’s latest graphics and audio experience combining
state-of-the-art
media-specific
features
with
high-performance processing while optimized for lowest
power consumption.
The i.MX 8M Nano family of processors features
advanced implementation of a quad Arm® Cor-
tex®-A53 core, which operates at speeds of up to
1.5 GHz. A general purpose Cortex®-M7 running up to
750 MHz core processor is for real-time and low-power
processing.
The i.MX 8M Nano family of processors provides addi-
tional computing resources and peripherals:
• Advanced security modules for secure boot,
cipher acceleration and DRM support
• A wide range of audio interfaces, including I2S,
AC 97, TDM, and S/PDIF
• Large set of peripherals that are commonly used
in consumer/industrial market, including USB
and Ethernet
NXP reserves the right to change the production detail specifications as may be
required to permit improvements in the design of its products.

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MIMX8MN3DVTJZAA MIMX8MN5DVTJZAA MIMX8MN6DVTJZAA MIMX8MN1DVTJZAA MIMX8MN4DVTJZAA MIMX8MN2DVTJZAA
Description Multifunction Peripheral Multifunction Peripheral Multifunction Peripheral Multifunction Peripheral Multifunction Peripheral Multifunction Peripheral
Is it Rohs certified? conform to conform to conform to conform to conform to conform to
Maker NXP NXP NXP NXP NXP NXP
Reach Compliance Code unknown unknown unknown unknown unknown unknown
Humidity sensitivity level 3 3 3 3 3 3
Peak Reflow Temperature (Celsius) 260 260 260 260 260 260
Maximum time at peak reflow temperature 40 40 40 40 40 40
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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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