15A, 400V, NPN, Si, POWER TRANSISTOR, TO-204AE, HERMETIC SEALED, METAL, TO-3, 2 PIN
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | SEMELAB |
Parts packaging code | BFM |
package instruction | FLANGE MOUNT, O-MBFM-P2 |
Contacts | 2 |
Reach Compliance Code | compliant |
Shell connection | COLLECTOR |
Maximum collector current (IC) | 15 A |
Collector-emitter maximum voltage | 400 V |
Configuration | SINGLE |
Minimum DC current gain (hFE) | 7 |
JEDEC-95 code | TO-204AE |
JESD-30 code | O-MBFM-P2 |
JESD-609 code | e1 |
Number of components | 1 |
Number of terminals | 2 |
Package body material | METAL |
Package shape | ROUND |
Package form | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Polarity/channel type | NPN |
Certification status | Not Qualified |
surface mount | NO |
Terminal surface | TIN SILVER COPPER |
Terminal form | PIN/PEG |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
Transistor component materials | SILICON |
BUW45.MODR1 | BUW45R1 | BUW45.MOD | |
---|---|---|---|
Description | 15A, 400V, NPN, Si, POWER TRANSISTOR, TO-204AE, HERMETIC SEALED, METAL, TO-3, 2 PIN | 15A, 400V, NPN, Si, POWER TRANSISTOR, TO-204AE, HERMETIC SEALED, METAL, TO-3, 2 PIN | 15A, 400V, NPN, Si, POWER TRANSISTOR, TO-204AE, HERMETIC SEALED, METAL, TO-3, 2 PIN |
Is it lead-free? | Lead free | Lead free | Contains lead |
Is it Rohs certified? | conform to | conform to | incompatible |
Parts packaging code | BFM | BFM | BFM |
package instruction | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 | FLANGE MOUNT, O-MBFM-P2 |
Contacts | 2 | 2 | 2 |
Reach Compliance Code | compliant | compliant | compliant |
Shell connection | COLLECTOR | COLLECTOR | COLLECTOR |
Maximum collector current (IC) | 15 A | 15 A | 15 A |
Collector-emitter maximum voltage | 400 V | 400 V | 400 V |
Configuration | SINGLE | SINGLE | SINGLE |
Minimum DC current gain (hFE) | 7 | 7 | 7 |
JEDEC-95 code | TO-204AE | TO-204AE | TO-204AE |
JESD-30 code | O-MBFM-P2 | O-MBFM-P2 | O-MBFM-P2 |
Number of components | 1 | 1 | 1 |
Number of terminals | 2 | 2 | 2 |
Package body material | METAL | METAL | METAL |
Package shape | ROUND | ROUND | ROUND |
Package form | FLANGE MOUNT | FLANGE MOUNT | FLANGE MOUNT |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Polarity/channel type | NPN | NPN | NPN |
Certification status | Not Qualified | Not Qualified | Not Qualified |
surface mount | NO | NO | NO |
Terminal form | PIN/PEG | PIN/PEG | PIN/PEG |
Terminal location | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Transistor component materials | SILICON | SILICON | SILICON |
JESD-609 code | e1 | e1 | - |
Terminal surface | TIN SILVER COPPER | TIN SILVER COPPER | - |
Base Number Matches | - | 1 | 1 |