H5TQ1G63BFR-G7I datasheet, PDF

H5TQ1G63BFR-G7I: DescriptionDDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE & ROHS COMPLIANT, FPBGA-96; Categorystorage storage; File Size312KB，31 Pages; ManufacturerSK Hynix; Websitehttp://www.hynix.com/eng/; Environmental Compliance

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H5TQ1G63BFR-G7I Overview

DDR DRAM, 64MX16, CMOS, PBGA96, HALOGEN FREE & ROHS COMPLIANT, FPBGA-96

Parameter Name	Attribute value
Is it Rohs certified?	conform to
Maker	SK Hynix
Parts packaging code	BGA
package instruction	TFBGA, BGA96,9X16,32
Contacts	96
Reach Compliance Code	unknown
ECCN code	EAR99
access mode	MULTI BANK PAGE BURST
Other features	AUTO/SELF REFRESH
Maximum clock frequency (fCLK)	533 MHz
I/O type	COMMON
interleaved burst length	4,8
JESD-30 code	R-PBGA-B96
JESD-609 code	e1
length	13 mm
memory density	1073741824 bit
Memory IC Type	DDR DRAM
memory width	16
Number of functions	1
Number of ports	1
Number of terminals	96
word count	67108864 words
character code	64000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	64MX16
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Encapsulate equivalent code	BGA96,9X16,32
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Celsius)	260
power supply	1.5 V
Certification status	Not Qualified
refresh cycle	8192
Maximum seat height	1.2 mm
self refresh	YES
Continuous burst length	4,8
Maximum standby current	0.01 A
Maximum slew rate	0.21 mA
Maximum supply voltage (Vsup)	1.575 V
Minimum supply voltage (Vsup)	1.425 V
Nominal supply voltage (Vsup)	1.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	20
width	7.5 mm

1Gb DDR3 SDRAM

Lead-Free&Halogen-Free

(RoHS Compliant)

H5TQ1G63BFR-xxC

H5TQ1G63BFR-xxI

H5TQ1G83BFR-xxC

H5TQ1G83BFR-xxI

*Hynix Semiconductor reserves the right to change products or specifications without notice

Rev. 1.1 / Sep. 2010

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