Fast Page DRAM, 2MX8, 70ns, CMOS, PDSO32, 0.400 INCH, PLASTIC, TSOP-32
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Micron Technology |
Parts packaging code | TSOP |
package instruction | 0.400 INCH, PLASTIC, TSOP-32 |
Contacts | 32 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE |
Maximum access time | 70 ns |
Other features | RAS ONLY; CAS BEFORE RAS; HIDDEN; BATTERY BACKUP; SELF REFRESH |
I/O type | COMMON |
JESD-30 code | R-PDSO-G32 |
JESD-609 code | e0 |
length | 20.96 mm |
memory density | 16777216 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 32 |
word count | 2097152 words |
character code | 2000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2MX8 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSOP2 |
Encapsulate equivalent code | TSOP32,.46 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 3/3.3 V |
Certification status | Not Qualified |
refresh cycle | 2048 |
Maximum seat height | 1.2 mm |
self refresh | YES |
Maximum standby current | 0.0002 A |
Maximum slew rate | 0.09 mA |
Maximum supply voltage (Vsup) | 3.3 V |
Minimum supply voltage (Vsup) | 2.7 V |
Nominal supply voltage (Vsup) | 3 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10.16 mm |