128KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28
| Parameter Name | Attribute value |
| Is it lead-free? | Lead free |
| Is it Rohs certified? | conform to |
| Maker | STMicroelectronics |
| Parts packaging code | DIP |
| package instruction | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 |
| Contacts | 28 |
| Reach Compliance Code | compliant |
| ECCN code | EAR99 |
| Maximum access time | 150 ns |
| JESD-30 code | R-GDIP-T28 |
| JESD-609 code | e3 |
| length | 36.92 mm |
| memory density | 1048576 bit |
| Memory IC Type | UVPROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 28 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP |
| Package shape | RECTANGULAR |
| Package form | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
| Certification status | Not Qualified |
| Maximum seat height | 5.72 mm |
| Maximum supply voltage (Vsup) | 5.25 V |
| Minimum supply voltage (Vsup) | 4.75 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin (Sn) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| M27C1011-15XF1 | M27C1011-12XF1 | M27C1011-12F1 | M27C1011-15F1 | |
|---|---|---|---|---|
| Description | 128KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 128KX8 UVPROM, 120ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 128KX8 UVPROM, 120ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | 128KX8 UVPROM, 150ns, CDIP28, FRIT SEALED, WINDOWED, CERAMIC, DIP-28 |
| Is it lead-free? | Lead free | Lead free | Lead free | Lead free |
| Is it Rohs certified? | conform to | conform to | conform to | conform to |
| Maker | STMicroelectronics | STMicroelectronics | STMicroelectronics | STMicroelectronics |
| Parts packaging code | DIP | DIP | DIP | DIP |
| package instruction | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 | FRIT SEALED, WINDOWED, CERAMIC, DIP-28 |
| Contacts | 28 | 28 | 28 | 28 |
| Reach Compliance Code | compliant | compliant | compli | compli |
| ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
| Maximum access time | 150 ns | 120 ns | 120 ns | 150 ns |
| JESD-30 code | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 | R-GDIP-T28 |
| JESD-609 code | e3 | e3 | e3 | e3 |
| length | 36.92 mm | 36.92 mm | 36.92 mm | 36.92 mm |
| memory density | 1048576 bit | 1048576 bit | 1048576 bi | 1048576 bi |
| Memory IC Type | UVPROM | UVPROM | UVPROM | UVPROM |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 28 | 28 | 28 | 28 |
| word count | 131072 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| encapsulated code | WDIP | WDIP | WDIP | WDIP |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW | IN-LINE, WINDOW |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum seat height | 5.72 mm | 5.72 mm | 5.72 mm | 5.72 mm |
| Maximum supply voltage (Vsup) | 5.25 V | 5.25 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.75 V | 4.75 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin (Sn) | Tin (Sn) | Tin (Sn) | Tin (Sn) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| width | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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