IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC16, 4 X 4 MM, LFCSP-16, Multiplexer or Switch
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | ADI |
| Parts packaging code | QFN |
| package instruction | 4 X 4 MM, LFCSP-16 |
| Contacts | 16 |
| Reach Compliance Code | unknown |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER |
| JESD-30 code | S-XQCC-N16 |
| JESD-609 code | e0 |
| length | 4 mm |
| Maximum negative supply voltage (Vsup) | -5.5 V |
| Negative supply voltage minimum (Vsup) | -4.5 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V |
| Number of channels | 4 |
| Number of functions | 1 |
| Number of terminals | 16 |
| Nominal off-state isolation | 75 dB |
| On-state resistance matching specifications | 0.5 Ω |
| Maximum on-state resistance (Ron) | 7 Ω |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -40 °C |
| Package body material | UNSPECIFIED |
| encapsulated code | HVQCCN |
| Encapsulate equivalent code | LCC16,.16SQ,25 |
| Package shape | SQUARE |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE |
| Peak Reflow Temperature (Celsius) | 220 |
| power supply | +-15/+12/+-5 V |
| Certification status | Not Qualified |
| Maximum seat height | 0.9 mm |
| Maximum signal current | 0.03 A |
| Maximum supply current (Isup) | 0.3 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| Maximum disconnect time | 150 ns |
| Maximum connection time | 150 ns |
| switch | BREAK-BEFORE-MAKE |
| technology | CMOS |
| Temperature level | AUTOMOTIVE |
| Terminal surface | TIN LEAD |
| Terminal form | NO LEAD |
| Terminal pitch | 0.65 mm |
| Terminal location | QUAD |
| Maximum time at peak reflow temperature | 30 |
| width | 4 mm |
| ADG1409YCP | ADG1408YRU | |
|---|---|---|
| Description | IC 4-CHANNEL, DIFFERENTIAL MULTIPLEXER, QCC16, 4 X 4 MM, LFCSP-16, Multiplexer or Switch | IC 8-CHANNEL, SGL ENDED MULTIPLEXER, PDSO16, MO-153-AB, TSSOP-16, Multiplexer or Switch |
| Is it lead-free? | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible |
| Maker | ADI | ADI |
| Parts packaging code | QFN | TSSOP |
| package instruction | 4 X 4 MM, LFCSP-16 | MO-153-AB, TSSOP-16 |
| Contacts | 16 | 16 |
| Reach Compliance Code | unknown | not_compliant |
| Analog Integrated Circuits - Other Types | DIFFERENTIAL MULTIPLEXER | SINGLE-ENDED MULTIPLEXER |
| JESD-30 code | S-XQCC-N16 | R-PDSO-G16 |
| JESD-609 code | e0 | e0 |
| length | 4 mm | 5 mm |
| Maximum negative supply voltage (Vsup) | -5.5 V | -5.5 V |
| Negative supply voltage minimum (Vsup) | -4.5 V | -4.5 V |
| Nominal Negative Supply Voltage (Vsup) | -5 V | -5 V |
| Number of channels | 4 | 8 |
| Number of functions | 1 | 1 |
| Number of terminals | 16 | 16 |
| Nominal off-state isolation | 75 dB | 75 dB |
| On-state resistance matching specifications | 0.5 Ω | 0.5 Ω |
| Maximum on-state resistance (Ron) | 7 Ω | 7 Ω |
| Maximum operating temperature | 125 °C | 125 °C |
| Minimum operating temperature | -40 °C | -40 °C |
| Package body material | UNSPECIFIED | PLASTIC/EPOXY |
| encapsulated code | HVQCCN | TSSOP |
| Encapsulate equivalent code | LCC16,.16SQ,25 | TSSOP16,.25 |
| Package shape | SQUARE | RECTANGULAR |
| Package form | CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| Peak Reflow Temperature (Celsius) | 220 | 240 |
| power supply | +-15/+12/+-5 V | +-15/+12/+-5 V |
| Certification status | Not Qualified | Not Qualified |
| Maximum seat height | 0.9 mm | 1.2 mm |
| Maximum signal current | 0.03 A | 0.03 A |
| Maximum supply current (Isup) | 0.3 mA | 0.3 mA |
| Maximum supply voltage (Vsup) | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V |
| surface mount | YES | YES |
| Maximum disconnect time | 150 ns | 150 ns |
| Maximum connection time | 150 ns | 150 ns |
| switch | BREAK-BEFORE-MAKE | BREAK-BEFORE-MAKE |
| technology | CMOS | CMOS |
| Temperature level | AUTOMOTIVE | AUTOMOTIVE |
| Terminal surface | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | GULL WING |
| Terminal pitch | 0.65 mm | 0.65 mm |
| Terminal location | QUAD | DUAL |
| Maximum time at peak reflow temperature | 30 | 30 |
| width | 4 mm | 4.4 mm |
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