Chip Beads
For signal line
MMZ series
Type:
MMZ0402
MMZ0603
MMZ1005
MMZ1608
MMZ2012
MMZ0603-E
MMZ1005-E
0402[01005 inch]*
0603[0201 inch]
1005[0402 inch]
1608[0603 inch]
2012[0805 inch]
0603[0201 inch]
1005[0402 inch]
* Dimensions Code JIS[EIA]
Issue date:
March 2013
• All specifications are subject to change without notice.
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
(1/28)
Chip Beads
For Signal Line
MMZ Series MMZ0402
FEATURES
• It is super small size(L0.4W0.2T0.2mm).
• It prevents radiated noise from high-speed signal lines.
• Maintain impedance to high frequency band.
• Because it adopts silver in internal electrode, it is low DC
resistance.
• Because it is not generate of cross talk with closed magnetic cir-
cuit structural design, high density assembly is possible.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, etc.
PRODUCT IDENTIFICATION
MMZ 0402 S 121 C T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
121:120 at 100MHz
(5) Characteristic type
(6) Packaging style
T: Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
(7)
Conformity to RoHS Directive
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
0.4±0.02
0.2±0.02
0.2
0.15 to 0.2
Weight: 0.08mg
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
20000 pieces/reel
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
0.2±0.02
0.15 to 0.2
0.08 to 0.14
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
ELECTRICAL CHARACTERISTICS
Part No.
MMZ0402S100C
MMZ0402S700C
MMZ0402S121C
MMZ0402S151C
Impedance
( )[100MHz]
10±5
70±25%
120±25%
150±25%
DC resistance
( )max.
0.10
0.45
0.70
0.70
0.18 to 0.2
Rated current
(mA)max.
500
260
210
200
Test equipment
:
E4991A or equivalent
Test tool
:
16197 or equivalent
Test temperature: 25±10°C
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
002-01 / 20130301 / e9412_mmz
(2/28)
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES)
MMZ0402S SERIES
300
MMZ0402S151C
250
MMZ0402S121C
Impedance (
Ω
)
200
MMZ0402S700C
150 MMZ0402S100C
100
50
0
1
10
100
1000
Frequency (MHz)
10000
Z, X, R vs. FREQUENCY CHARACTERISTICS
MMZ0402S100C
MMZ0402S700C
20
160
140
Impedance (
Ω
)
Impedance (
Ω
)
MMZ0402S121C
250
200
Impedance (
Ω
)
Z
R
Z
150
R
100
X
50
0
15
Z
10
R
X
5
120
100
80
60
40
20
X
0
1
10
100
1000
Frequency (MHz)
10000
0
1
10
100
1000
Frequency (MHz)
10000
1
10
100
1000
Frequency (MHz)
10000
MMZ0402S151C
300
250
Impedance (
Ω
)
100
150
100
50
0
1
10
100
1000
Frequency (MHz)
10000
Z
R
X
PACKAGING STYLES
REEL DIMENSIONS
TAPE DIMENSIONS
1.5
+0.1
–0.0
1.75±0.1
300min.
Dimensions in mm
0.46±0.04
3.5±0.05
8.0±0.2
0.4max.
0.26±0.04
4.0±0.1
2.0±0.05
2.0±0.05
160min.
14.4max.
Taping
200min.
Dimensions in mm
Drawing direction
1.0
Sprocket hole
Cavity
2.0±0.5
ø13±0.2
ø21±0.8
ø180±2.0
8.4
+2.0
–0.0
• All specifications are subject to change without notice.
002-01 / 20130301 / e9412_mmz
ø60min.
(3/28)
Chip Beads
For Signal Line
MMZ Series MMZ0603
FEATURES
• This is a multilayered chip bead product with dimensions of
L0.6W0.3T0.3mm.
• The product is magnetically shielded, allowing high density
mounting.
• We refined the rules for internal conductor design to reduce
floating capacity between conductors, which in turn has
contributed to a dramatic improvement in high frequency
characteristics. We have also been able to expand and reinforce
the EMI suppression in the GHz range.
• It is a product conforming to RoHS directive.
APPLICATIONS
Removal of signal line noises of cellular phones, portable audio
players, various modules, DSCs, portable game machines, etc.
PRODUCT IDENTIFICATION
MMZ 0603 S 121 C T
(1)
(2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions LW
(3) Type name
(4) Impedance
121:120 at 100MHz
(5) Characteristic type
(6) Packaging style
T:Taping
(7) TDK internal code
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components. The preheat-
ing temperature should be set so that the temperature difference
between the solder temperature and product temperature does
not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• Do not expose the inductors to stray magnetic fields.
• Avoid static electricity discharge during handling.
• When hand soldering, apply the soldering iron to the printed cir-
cuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
(7)
Conformity to RoHS Directive
MATERIAL CHARACTERISTICS
S material: Standard type that features impedance characteristics
similar to those of a typical ferrite core.
For signal line applications in which the blocking region
is near 100MHz. Impedance values selected for effec-
tiveness at 40 to 300MHz.
Y material: High frequency range type intended for the 100MHz
region and above.
For signal line applications in which the signal fre-
quency is far from the cutoff frequency. Impedance val-
ues selected for effectiveness at 80 to 400MHz.
D material: For applications calling for low insertion loss at low fre-
quencies and sharply increasing impedance at high
frequencies. Designed for high impedance at high fre-
quencies (300MHz to 1GHz) for signal line applica-
tions.
F material: This new product inherits the characteristic of our D-
material, namely its sharp impedance rise time, and its
impedance peak frequency has been shifted higher
into range. The product offers excellent noise suppres-
sion from 600MHz to as high as in the GHz range.
TYPICAL MATERIAL CHARACTERISTICS
2000
1800
1600
Impedance(
Ω
)
1400
1200
1000
800
600
400
200
0
10
100
Frequency(MHz)
1000
S
F
Y
D
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application is considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
002-01 / 20130301 / e9412_mmz
(4/28)
SHAPES AND DIMENSIONS/RECOMMENDED PC BOARD
PATTERN
0.6±0.03
0.3±0.03
0.30
ELECTRICAL CHARACTERISTICS
Part No.
MMZ0603S100C
MMZ0603S800C
MMZ0603S121C
MMZ0603S241C
MMZ0603S471C
MMZ0603S601C
MMZ0603S102H
MMZ0603Y750C
MMZ0603Y121C
MMZ0603Y241C
MMZ0603Y471C
MMZ0603Y601C
MMZ0603D330C
MMZ0603D470C
MMZ0603D560C
MMZ0603D800C
MMZ0603D121C
MMZ0603F100C
MMZ0603F220C
MMZ0603F330C
0.25
0.1min.
0.30
0.25
Weight: 0.3mg
Dimensions in mm
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C(After mount)
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
15000 pieces/reel
Impedance
( )[100MHz]
10±5
80±25%
120±25%
240±25%
470±25%
600±25%
1000±25%
75±25%
120±25%
240±25%
470±25%
600±25%
33±25%
47±25%
56±25%
80±25%
120±25%
10±5
22±25%
33±25%
DC resistance
()max.
0.09
0.30
0.45
0.57
1.30
1.45
1.25
0.35
0.39
0.80
1.40
1.50
0.70
0.70
0.95
1.25
1.40
0.50
1.00
1.30
Rated current
(mA)max.
500
200
200
200
100
100
200
300
200
200
200
200
200
200
100
100
100
200
200
150
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
0.3±0.03
Test equipment
:
E4991A or equivalent
Test tool
:
16197 or equivalent
Test temperature: 25±10°C
10s max.
250 to 260˚C
230˚C
Natural
cooling
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
TYPICAL ELECTRICAL CHARACTERISTICS
Z FREQUENCY CHARACTERISTICS(DIFFERS ACCORDING TO SERIES)
MMZ0603S SERIES
MMZ0603Y SERIES
1400
MMZ0603S601C
1200 MMZ0603S471C
MMZ0603S241C
1000 MMZ0603S121C
MMZ0603S800C
800 MMZ0603S100C
600
400
200
0
1
10
100
1000
Frequency (MHz)
10000
0
MMZ0603S102H
1000
MMZ0603Y601C
MMZ0603D SERIES
1000
MMZ0603D121C
800
Impedance (
Ω
)
600
400
200
0
MMZ0603D800C
MMZ0603D560C
MMZ0603D470C
MMZ0603D330C
800 MMZ0603Y471C
Impedance (
Ω
)
MMZ0603Y241C
600 MMZ0603Y121C
MMZ0603Y750C
400
200
Impedance (
Ω
)
1
10
100
1000
Frequency (MHz)
10000
1
10
100
1000
Frequency (MHz)
10000
MMZ0603F SERIES
1200
1000
Impedance (
Ω
)
800
600
400
200
0
1
10
100
1000
Frequency (MHz)
10000
MMZ0603F220C
MMZ0603F100C
MMZ0603F330C
• All specifications are subject to change without notice.
002-01 / 20130301 / e9412_mmz
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