CDR05BX334AKUR datasheet, PDF - EEWORLD Datasheet

Datasheet> All Categories > Passive components> capacitor> CDR05BX334AKUR

CDR05BX334AKUR: DescriptionCeramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.33uF, Surface Mount, 1825, CHIP; CategoryPassive components capacitor; File Size39KB，2 Pages; ManufacturerAVX

Download Datasheet Parametric View All

CDR05BX334AKUR Overview

Ceramic Capacitor, Multilayer, Ceramic, 50V, 10% +Tol, 10% -Tol, BX, 15% TC, 0.33uF, Surface Mount, 1825, CHIP

CDR05BX334AKUR Parametric

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	AVX
package instruction	, 1825
Reach Compliance Code	not_compliant
ECCN code	EAR99
Factory Lead Time	28 weeks
capacitance	0.33 µF
Capacitor type	CERAMIC CAPACITOR
Custom functions	TAPE & REEL AVAILABLE UPON REQUEST
dielectric materials	CERAMIC
high	2.032 mm
JESD-609 code	e0
length	6.35 mm
Installation features	SURFACE MOUNT
multi-layer	Yes
negative tolerance	10%
Number of terminals	2
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package shape	RECTANGULAR PACKAGE
Package form	SMT
method of packing	BULK
positive tolerance	10%
Rated (DC) voltage (URdc)	50 V
Guideline	MIL-PRF-55681
size code	1825
surface mount	YES
Temperature characteristic code	BX
Temperature Coefficient	15% ppm/°C
Terminal surface	Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier
Terminal shape	WRAPAROUND
width	4.572 mm

Preview

Download Datasheet

View All

MIL-PRF-55681/Chips

Part Number Example

CDR01 thru CDR06

MILITARY DESIGNATION PER MIL-PRF-55681

Part Number Example

CDR01

MIL Style

Voltage-temperature

Limits

101

Capacitance

Rated Voltage

Capacitance Tolerance

Termination Finish

Failure Rate

NOTE: Contact factory for availability of Termination and Tolerance Options for

Specific Part Numbers.

MIL Style:

CDR01, CDR02, CDR03, CDR04, CDR05,

CDR06

Voltage Temperature Limits:

BP = 0 ± 30 ppm/°C without voltage; 0 ± 30 ppm/°C with

rated voltage from -55°C to +125°C

BX = ±15% without voltage; +15 –25% with rated voltage

from -55°C to +125°C

Capacitance:

Two digit figures followed by multiplier

(number of zeros to be added) e.g., 101 = 100 pF

Rated Voltage:

A = 50V, B = 100V

Capacitance Tolerance:

J ± 5%, K ± 10%, M ± 20%

Termination Finish:

M = Palladium Silver

N = Silver Nickel Gold

S = Solder-coated

U = Base Metallization/Barrier

Metal/Solder Coated*

W = Base Metallization/Barrier

Metal/Tinned (Tin or Tin/

Lead Alloy)

*Solder shall have a melting point of 200°C or less.

Failure Rate Level:

M = 1.0%, P = .1%, R = .01%,

S = .001%

Packaging:

Bulk is standard packaging. Tape and reel

per RS481 is available upon request.

CROSS REFERENCE: AVX/MIL-PRF-55681/CDR01 THRU CDR06*

Per

MIL-PRF-55681

CDR01

CDR02

CDR03

CDR04

CDR05

CDR06

AVX

Style

0805

1805

1808

1812

1825

2225

Length (L)

.080 ± .015

.180 ± .015

.180 +.020

-.015

.225 ± .020

Width (W)

.050 ± .015

.080 ± .018

.125 ± .015

.250 +.020

-.015

.250 ± .020

Thickness (T)

Max.

Min.

.055

.080

.020

Max.

—

Min.

.030

—

Termination Band (t)

Max.

Min.

—

.030

.010

*For CDR11, 12, 13, and 14 see AVX Microwave Chip Capacitor Catalog

Recommended Resources

touch circuit

Automatic switching control circuit for two parallel transformers

LTC1149 diagram pin configuration and basic application circuit diagram

555 indoor humidity control circuit

Pulse forming circuit composed of integrating circuit method

Proportional feedback and differential feedback circuits

Microstrip————Microstrip line: Microstrip What is Microstrip? The problem of wiring layout in low-frequency circuit boards emphasizes the concept of efficient space layout. This is because the impact on production cost is greatly a...; btty038 RF/Wirelessly

IIC control of DSP: [size=4]Generally, DSPs are integrated with I2C modules, so that external devices can be easily controlled when connected. I2C is basically used for external control because it is a serial bus. On our...; Aguilera DSP and ARM Processors

Can the master device send data to the slave device?: I am using bluetooth master module and CC2541 slave to connect. Can the master module send data to the slave module? If so, where is the TIperipheral routine that receives and processes the data? I ca...; chenbingjy Wireless Connectivity

[Sipeed LicheeRV 86 Panel Review] 4-Building the Compilation Environment: This article refers to the tutorial of the Allwinner Development Community: https://d1.docs.aw-ol.com/study/study_6helloword/ , and tries to run a hello word program on the board. Although the operati...; DDZZ669 Domestic Chip Exchange

DIY multifunctional STM32 mini remote control (with engineering files, can be used directly as a board): I made a multifunctional STM32 mini remote control in my spare time during the holiday. Because the PCB company was having a promotion, I could get the board for 5 yuan! After receiving the board, I o...; bqgup Innovation Lab

What does the internal structure of this chip mean? Any experts passing by, please come in and give me some advice, please!!!: NCV78763 chip internal diagram, this is how each part works...; 李李李李达 MCU

Shortcut: E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 EA EB EC ED EE EF EG EH EI EJ EK EL EM EN EO EP EQ ER ES ET EU EV EW EX EY EZ F0 F1 F2 F3 F4 F5 F6 F7 F8 F9 FA FB FC FD FE FF FG FH FI FJ FK FL FM FN FO FP FQ FR FS FT FU FV FW FX FY FZ G0 G1 G2 G3 G4 G5 G6 G7 G8 G9 GA GB GC GD GE GF GG GH GI GJ GK GL GM GN GO GP GQ GR GS GT GU GV GW GX GZ H0 H1 H2 H3 H4 H5 H6 H7 H8 HA HB HC HD HE HF HG HH HI HJ HK HL HM HN HO HP HQ HR HS HT HU HV HW HX HY HZ I1 I2 I3 I4 I5 I6 I7 IA IB IC ID IE IF IG IH II IK IL IM IN IO IP IQ IR IS IT IU IV IW IX J0 J1 J2 J6 J7 JA JB JC JD JE JF JG JH JJ JK JL JM JN JP JQ JR JS JT JV JW JX JZ K0 K1 K2 K3 K4 K5 K6 K7 K8 K9 KA KB KC KD KE KF KG KH KI KJ KK KL KM KN KO KP KQ KR KS KT KU KV KW KX KY KZ

Popular Components