S29NS128NBJW002 datasheet, PDF

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S29NS128NBJW002: DescriptionFlash, 8MX16, PBGA44, 9.2 X 8 MM, LEAD FREE, FBGA-44; Categorystorage storage; File Size2MB，86 Pages; ManufacturerSPANSION; Websitehttp://www.spansion.com/; Environmental Compliance

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S29NS128NBJW002 Overview

Flash, 8MX16, PBGA44, 9.2 X 8 MM, LEAD FREE, FBGA-44

S29NS128NBJW002 Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	SPANSION
Parts packaging code	BGA
package instruction	9.2 X 8 MM, LEAD FREE, FBGA-44
Contacts	44
Reach Compliance Code	compliant
ECCN code	3A991.B.1.A
startup block	BOTTOM/TOP
Maximum clock frequency (fCLK)	66 MHz
JESD-30 code	R-PBGA-B44
JESD-609 code	e1
length	9.2 mm
memory density	134217728 bit
Memory IC Type	FLASH
memory width	16
Humidity sensitivity level	3
Number of functions	1
Number of terminals	44
word count	8388608 words
character code	8000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	8MX16
Package body material	PLASTIC/EPOXY
encapsulated code	VFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Programming voltage	1.8 V
Certification status	Not Qualified
Maximum seat height	1 mm
Maximum supply voltage (Vsup)	1.95 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal surface	TIN SILVER COPPER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	40
type	NOR TYPE
width	8 mm

S29NS128NBJW002 Related Products

	S29NS128NBJW002	S29NS064NBJW000	S29NS128NBJW003	S29NS064NBJW002	S29NS128NBJW000	S29NS064NBJW003
Description	Flash, 8MX16, PBGA44, 9.2 X 8 MM, LEAD FREE, FBGA-44	Flash, 4MX16, PBGA44, 7.70 X 6.20 MM, LEAD FREE, FBGA-44	Flash, 8MX16, PBGA44, 9.2 X 8 MM, LEAD FREE, FBGA-44	Flash, 4MX16, PBGA44, 7.70 X 6.20 MM, LEAD FREE, FBGA-44	Flash, 8MX16, PBGA44, 9.2 X 8 MM, LEAD FREE, FBGA-44	Flash, 4MX16, PBGA44, 7.70 X 6.20 MM, LEAD FREE, FBGA-44
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	9.2 X 8 MM, LEAD FREE, FBGA-44	7.70 X 6.20 MM, LEAD FREE, FBGA-44	9.2 X 8 MM, LEAD FREE, FBGA-44	7.70 X 6.20 MM, LEAD FREE, FBGA-44	9.2 X 8 MM, LEAD FREE, FBGA-44	7.70 X 6.20 MM, LEAD FREE, FBGA-44
Contacts	44	44	44	44	44	44
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant	compliant
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
startup block	BOTTOM/TOP	BOTTOM/TOP	BOTTOM/TOP	BOTTOM/TOP	BOTTOM/TOP	BOTTOM/TOP
Maximum clock frequency (fCLK)	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz	66 MHz
JESD-30 code	R-PBGA-B44	R-PBGA-B44	R-PBGA-B44	R-PBGA-B44	R-PBGA-B44	R-PBGA-B44
JESD-609 code	e1	e1	e1	e1	e1	e1
length	9.2 mm	7.7 mm	9.2 mm	7.7 mm	9.2 mm	7.7 mm
memory density	134217728 bit	67108864 bit	134217728 bit	67108864 bit	134217728 bit	67108864 bit
Memory IC Type	FLASH	FLASH	FLASH	FLASH	FLASH	FLASH
memory width	16	16	16	16	16	16
Humidity sensitivity level	3	3	3	3	3	3
Number of functions	1	1	1	1	1	1
Number of terminals	44	44	44	44	44	44
word count	8388608 words	4194304 words	8388608 words	4194304 words	8388608 words	4194304 words
character code	8000000	4000000	8000000	4000000	8000000	4000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	8MX16	4MX16	8MX16	4MX16	8MX16	4MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA	VFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH	GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	260	260	260	260
Programming voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1 mm	1 mm	1 mm	1 mm	1 mm	1 mm
Maximum supply voltage (Vsup)	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V	1.95 V
Minimum supply voltage (Vsup)	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V	1.7 V
Nominal supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
surface mount	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal surface	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER	TIN SILVER COPPER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	40	40	40	40	40	40
type	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE	NOR TYPE
width	8 mm	6.2 mm	8 mm	6.2 mm	8 mm	6.2 mm
Maker	SPANSION	-	-	SPANSION	SPANSION	SPANSION

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