EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Catalyst |
package instruction | TSSOP, TSSOP28,.53,22 |
Reach Compliance Code | unknown |
Maximum access time | 250 ns |
command user interface | NO |
Data polling | YES |
Durability | 100000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G28 |
JESD-609 code | e0 |
memory density | 262144 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of terminals | 28 |
word count | 32768 words |
character code | 32000 |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 32KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | TSSOP |
Encapsulate equivalent code | TSSOP28,.53,22 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
page size | 64 words |
Parallel/Serial | PARALLEL |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.00015 A |
Maximum slew rate | 0.03 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 0.55 mm |
Terminal location | DUAL |
switch bit | YES |
Maximum write cycle time (tWC) | 5 ms |
CAT28C256HT13I-25 | CAT28C256HN-25 | CAT28C256HT14-25 | CAT28C256HT14I-15 | CAT28C256T14I-12 | CAT28C256T14I-15 | CAT28C256T14I-25 | |
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Description | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO28 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PQCC32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 150ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 120ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 150ns, Parallel, CMOS, PDSO32 | EEPROM, 32KX8, 250ns, Parallel, CMOS, PDSO32 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
package instruction | TSSOP, TSSOP28,.53,22 | QCCJ, LDCC32,.5X.6 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 | TSSOP, TSSOP32,.56,20 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 250 ns | 250 ns | 250 ns | 150 ns | 120 ns | 150 ns | 250 ns |
command user interface | NO | NO | NO | NO | NO | NO | NO |
Data polling | YES | YES | YES | YES | YES | YES | YES |
Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles | 10000 Write/Erase Cycles |
JESD-30 code | R-PDSO-G28 | R-PQCC-J32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 | R-PDSO-G32 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
memory density | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit | 262144 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of terminals | 28 | 32 | 32 | 32 | 32 | 32 | 32 |
word count | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words | 32768 words |
character code | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 | 32000 |
Maximum operating temperature | 85 °C | 70 °C | 70 °C | 85 °C | 85 °C | 85 °C | 85 °C |
Minimum operating temperature | -40 °C | - | - | -40 °C | -40 °C | -40 °C | -40 °C |
organize | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 | 32KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | TSSOP | QCCJ | TSSOP | TSSOP | TSSOP | TSSOP | TSSOP |
Encapsulate equivalent code | TSSOP28,.53,22 | LDCC32,.5X.6 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 | TSSOP32,.56,20 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | CHIP CARRIER | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
page size | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words | 64 words |
Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum standby current | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A | 0.00015 A |
Maximum slew rate | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA | 0.03 mA |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING | J BEND | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal pitch | 0.55 mm | 1.27 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
Terminal location | DUAL | QUAD | DUAL | DUAL | DUAL | DUAL | DUAL |
switch bit | YES | YES | YES | YES | YES | YES | YES |
Maximum write cycle time (tWC) | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms | 5 ms |