Edition 2013-01
Published by
Infineon Technologies AG
81726 Munich, Germany
©
2013 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
XMC4500
XMC4000 Family
XMC4500 Data Sheet
Revision History: V1.0 2013-01
Previous Versions:
V0.9, 2012-12
V0.8, 2012-11
Page
11
33
56
66
72
Subjects
Reflect the supported Ethernet interface depending on the package (MII,
RMII).
Characterization and qualification completed for PG-LQFP-144 and PG-
LQFP-100.
Changed frequency dependency of the
I
DDP
current from 5 mA per 10 MHz
to 6 mA per 10 MHz (see footnote 10).
Improved Fast Internal Clock Source parameters.
DSD timing parameters will be added in a future revision of the Data Sheet.
Trademarks
C166™, TriCore™ and DAVE™ are trademarks of Infineon Technologies AG.
ARM
®
, ARM Powered
®
and AMBA
®
are registered trademarks of ARM, Limited.
Cortex™, CoreSight™, ETM™, Embedded Trace Macrocell™ and Embedded Trace
Buffer™ are trademarks of ARM, Limited.
Synopsys™ is a trademark of Synopsys, Inc.
We Listen to Your Comments
Is there any information in this document that you feel is wrong, unclear or missing?
Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
mcdocu.comments@infineon.com
Data Sheet
V1.0, 2013-01
Subject to Agreement on the Use of Product Information
XMC4500
XMC4000 Family
Table of Contents
Table of Contents
Table of Contents
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
About this Document
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1
1.1
1.2
1.3
1.4
1.5
2
2.1
2.2
2.2.1
2.2.2
2.2.2.1
3
3.1
3.1.1
3.1.2
3.1.3
3.1.4
3.1.5
3.2
3.2.1
3.2.2
3.2.3
3.2.4
3.2.5
3.2.6
3.2.7
3.2.8
3.2.9
3.3
3.3.1
3.3.2
3.3.3
3.3.4
3.3.5
3.3.6
Summary of Features
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
Device Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Device Type Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Definition of Feature Variants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Identification Registers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
General Device Information
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration and Definition . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Pin Summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Port I/O Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Port I/O Function Table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Electrical Parameters
. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Reliability in Overload . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . .
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog to Digital Converters (VADC) . . . . . . . . . . . . . . . . . . . . . . . . . . .
Digital to Analog Converters (DAC) . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Out-of-Range Comparator (ORC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Die Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
USB OTG Interface DC Characteristics . . . . . . . . . . . . . . . . . . . . . . . . .
Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power-Up and Supply Monitoring . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Phase Locked Loop (PLL) Characteristics . . . . . . . . . . . . . . . . . . . . . .
Internal Clock Source Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . .
JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
14
14
17
20
26
27
33
33
33
34
35
36
37
38
38
43
47
49
51
52
54
56
59
61
61
62
63
65
66
68
Data Sheet
5
V1.0, 2013-01
Subject to Agreement on the Use of Product Information
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