Standard SRAM, 64KX16, 15ns, CMOS, PBGA48
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Reach Compliance Code | not_compliant |
| Maximum access time | 15 ns |
| I/O type | COMMON |
| JESD-30 code | R-PBGA-B48 |
| JESD-609 code | e0 |
| memory density | 1048576 bit |
| Memory IC Type | STANDARD SRAM |
| memory width | 16 |
| Humidity sensitivity level | 3 |
| Number of terminals | 48 |
| word count | 65536 words |
| character code | 64000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 85 °C |
| Minimum operating temperature | -40 °C |
| organize | 64KX16 |
| Output characteristics | 3-STATE |
| Package body material | PLASTIC/EPOXY |
| encapsulated code | FBGA |
| Encapsulate equivalent code | BGA48,6X8,30 |
| Package shape | RECTANGULAR |
| Package form | GRID ARRAY, FINE PITCH |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| power supply | 2.5 V |
| Certification status | Not Qualified |
| Maximum standby current | 0.005 A |
| Minimum standby current | 2.38 V |
| Maximum slew rate | 0.08 mA |
| Nominal supply voltage (Vsup) | 2.5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | INDUSTRIAL |
| Terminal surface | Tin/Lead (Sn63Pb37) |
| Terminal form | BALL |
| Terminal pitch | 0.75 mm |
| Terminal location | BOTTOM |
| Maximum time at peak reflow temperature | 20 |
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