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T2525S376C-DDW

Description
Telecom Circuit, 1-Func, WAFER-10
CategoryWireless rf/communication    Telecom circuit   
File Size216KB,12 Pages
ManufacturerAtmel (Microchip)
Download Datasheet Parametric Compare View All

T2525S376C-DDW Overview

Telecom Circuit, 1-Func, WAFER-10

T2525S376C-DDW Parametric

Parameter NameAttribute value
MakerAtmel (Microchip)
Parts packaging codeWAFER
package instructionDIE,
Contacts10
Reach Compliance Codeunknown
JESD-30 codeR-XUUC-N10
Number of functions1
Number of terminals10
Maximum operating temperature85 °C
Minimum operating temperature-25 °C
Package body materialUNSPECIFIED
encapsulated codeDIE
Package shapeRECTANGULAR
Package formUNCASED CHIP
Certification statusNot Qualified
Nominal supply voltage5 V
surface mountYES
Telecom integrated circuit typesTELECOM CIRCUIT
Temperature levelOTHER
Terminal formNO LEAD
Terminal locationUPPER
Features
No External Components Except PIN Diode
Supply-voltage Range: 4.5V to 5.5V
Highest Sensitivity Due to Automatic Sensitivity Adaption (AGC) and Automatic Strong
Signal Adaption (ATC)
Highest Immunity Against Disturbances from Daylight and Lamps
Available for Carrier Frequencies between 30 kHz to 76 kHz; Adjusted
by Zener Diode Fusing
TTL and CMOS Compatible
Suitable Minimum Burst Length
10 Pulses/Burst
Applications
Home Entertainment Applications (Audio/Video)
Home Appliances
Remote Control Equipment
IR Receiver
ASSP
T2525
1. Description
The IC T2525 is a complete IR receiver for data communication that was developed
and optimized for use in carrier-frequency-modulated transmission applications. The
IC offers highest sensitivity as well as highest suppression of noise from daylight and
lamps. The T2525 is available with broadest range of carrier frequencies (30, 33, 36,
37, 38, 40, 44, 56, 76 kHz) and 5 different noise suppression regulation types (stan-
dard, lamp, noise, short burst, data rate) covering requirements of high-end remote
control solutions (please refer to selection guide available for T2525/ATA2526). The
T2525 operates in a supply voltage range of 4.5V to 5.5V.
The function of T2525 can be described using the block diagram (see
Figure 1-1 on
page 2).
The input stage meets two main functions. First, it provides a suitable bias
voltage for the PIN diode. Secondly, the pulsed photo-current signals are transformed
into a voltage by a special circuit which is optimized for low-noise applications. After
amplification by a
Controlled Gain Amplifier
(CGA), the signals have to pass a tuned
integrated narrow bandpass filter with a center frequency f
0
which is equivalent to the
chosen carrier frequency of the input signal. The demodulator is used to convert the
input burst signal into a digital envelope output pulse and to evaluate the signal infor-
mation quality, i.e., unwanted pulses will be suppressed at the output pin. All this is
done by means of an integrated dynamic feedback circuit which varies the gain as a
function of the present environmental condition (ambient light, modulated lamps etc.).
Other special features are used to adapt to the current application to secure best
transmission quality.
4657G–AUTO–09/09

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Description Telecom Circuit, 1-Func, WAFER-10 Telecom Circuit, 1-Func, WAFER-10 Telecom Circuit, 1-Func, WAFER-10 Telecom Circuit, 1-Func, WAFER-10 Telecom Circuit, 1-Func, WAFER-10 Telecom Circuit, 1-Func, WAFER-10
Maker Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip) Atmel (Microchip)
Parts packaging code WAFER WAFER WAFER WAFER WAFER WAFER
package instruction DIE, DIE, DIE, DIE, DIE, DIE,
Contacts 10 10 10 10 10 10
Reach Compliance Code unknown unknown unknown unknown unknown unknown
JESD-30 code R-XUUC-N10 R-XUUC-N10 R-XUUC-N10 R-XUUC-N10 R-XUUC-N10 R-XUUC-N10
Number of functions 1 1 1 1 1 1
Number of terminals 10 10 10 10 10 10
Maximum operating temperature 85 °C 85 °C 85 °C 85 °C 85 °C 85 °C
Minimum operating temperature -25 °C -25 °C -25 °C -25 °C -25 °C -25 °C
Package body material UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED UNSPECIFIED
encapsulated code DIE DIE DIE DIE DIE DIE
Package shape RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
Package form UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP UNCASED CHIP
Certification status Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
Nominal supply voltage 5 V 5 V 5 V 5 V 5 V 5 V
surface mount YES YES YES YES YES YES
Telecom integrated circuit types TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT TELECOM CIRCUIT
Temperature level OTHER OTHER OTHER OTHER OTHER OTHER
Terminal form NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD NO LEAD
Terminal location UPPER UPPER UPPER UPPER UPPER UPPER
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