W29C011AP-15N datasheet, PDF - EEWORLD Datasheet

W29C011AP-15N: DescriptionFlash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32; Categorystorage storage; File Size167KB，19 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W29C011AP-15N Overview

Flash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	QFJ
package instruction	PLASTIC, LCC-32
Contacts	32
Reach Compliance Code	not_compliant
ECCN code	EAR99
Maximum access time	150 ns
JESD-30 code	R-PQCC-J32
JESD-609 code	e0
length	13.97 mm
memory density	1048576 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	32
word count	131072 words
character code	128000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	128KX8
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Package shape	RECTANGULAR
Package form	CHIP CARRIER
Parallel/Serial	PARALLEL
Programming voltage	5 V
Certification status	Not Qualified
Maximum seat height	3.56 mm
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
type	NOR TYPE
width	11.43 mm
Maximum write cycle time (tWC)	10 ms

	W29C011AP-15N	W29C011A-15N
Description	Flash, 128KX8, 150ns, PQCC32, PLASTIC, LCC-32	Flash, 128KX8, 150ns, PDIP32, 0.600 INCH, PLASTIC, DIP-32
Is it Rohs certified?	incompatible	incompatible
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	QFJ	DIP
package instruction	PLASTIC, LCC-32	0.600 INCH, PLASTIC, DIP-32
Contacts	32	32
Reach Compliance Code	not_compliant	not_compliant
ECCN code	EAR99	EAR99
Maximum access time	150 ns	150 ns
JESD-30 code	R-PQCC-J32	R-PDIP-T32
JESD-609 code	e0	e0
length	13.97 mm	41.91 mm
memory density	1048576 bit	1048576 bit
Memory IC Type	FLASH	FLASH
memory width	8	8
Number of functions	1	1
Number of terminals	32	32
word count	131072 words	131072 words
character code	128000	128000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C
organize	128KX8	128KX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	DIP
Package shape	RECTANGULAR	RECTANGULAR
Package form	CHIP CARRIER	IN-LINE
Parallel/Serial	PARALLEL	PARALLEL
Programming voltage	5 V	5 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	3.56 mm	5.33 mm
Maximum supply voltage (Vsup)	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V
surface mount	YES	NO
technology	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	J BEND	THROUGH-HOLE
Terminal pitch	1.27 mm	2.54 mm
Terminal location	QUAD	DUAL
type	NOR TYPE	NOR TYPE
width	11.43 mm	15.24 mm
Maximum write cycle time (tWC)	10 ms	10 ms

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