GS832132E-166VT datasheet, PDF

GS832132E-166VT: DescriptionCache SRAM, 1MX32, 7ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165; Categorystorage storage; File Size2MB，31 Pages; ManufacturerGSI Technology; Websitehttp://www.gsitechnology.com/

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GS832132E-166VT Overview

Cache SRAM, 1MX32, 7ns, CMOS, PBGA165, 15 X 17 MM, 1 MM PITCH, FPBGA-165

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	GSI Technology
Parts packaging code	BGA
package instruction	LBGA, BGA165,11X15,40
Contacts	165
Reach Compliance Code	compliant
ECCN code	3A991.B.2.B
Maximum access time	7 ns
Other features	FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 2.5V SUPPLY
Maximum clock frequency (fCLK)	166 MHz
I/O type	COMMON
JESD-30 code	R-PBGA-B165
length	17 mm
memory density	33554432 bit
Memory IC Type	CACHE SRAM
memory width	32
Number of functions	1
Number of terminals	165
word count	1048576 words
character code	1000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	1MX32
Output characteristics	3-STATE
Package body material	PLASTIC/EPOXY
encapsulated code	LBGA
Encapsulate equivalent code	BGA165,11X15,40
Package shape	RECTANGULAR
Package form	GRID ARRAY, LOW PROFILE
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/2.5 V
Certification status	Not Qualified
Maximum seat height	1.5 mm
Maximum standby current	0.06 A
Minimum standby current	2.3 V
Maximum slew rate	0.225 mA
Maximum supply voltage (Vsup)	2 V
Minimum supply voltage (Vsup)	1.7 V
Nominal supply voltage (Vsup)	1.8 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal form	BALL
Terminal pitch	1 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
width	15 mm

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