|
MR27V852D-RS |
MR27V852D-GS-K |
Description |
OTP ROM, 1MX8, 80ns, CMOS, PDIP42 |
OTP ROM, 1MX8, 80ns, CMOS, PDSO44 |
Is it Rohs certified? |
incompatible |
incompatible |
Maker |
LAPIS Semiconductor Co., Ltd. |
LAPIS Semiconductor Co., Ltd. |
package instruction |
DIP, DIP42,.6 |
SOP, SOP44,.63 |
Reach Compliance Code |
unknown |
unknow |
Maximum access time |
80 ns |
80 ns |
I/O type |
COMMON |
COMMON |
JESD-30 code |
R-PDIP-T42 |
R-PDSO-G44 |
JESD-609 code |
e0 |
e0 |
memory density |
8388608 bit |
8388608 bi |
memory width |
8 |
8 |
Number of terminals |
42 |
44 |
word count |
1048576 words |
1048576 words |
character code |
1000000 |
1000000 |
Maximum operating temperature |
70 °C |
70 °C |
organize |
1MX8 |
1MX8 |
Output characteristics |
3-STATE |
3-STATE |
Package body material |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
encapsulated code |
DIP |
SOP |
Encapsulate equivalent code |
DIP42,.6 |
SOP44,.63 |
Package shape |
RECTANGULAR |
RECTANGULAR |
Package form |
IN-LINE |
SMALL OUTLINE |
power supply |
3.3 V |
3.3 V |
Certification status |
Not Qualified |
Not Qualified |
Maximum standby current |
0.00001 A |
0.00001 A |
Maximum slew rate |
0.08 mA |
0.08 mA |
Nominal supply voltage (Vsup) |
3.3 V |
3.3 V |
surface mount |
NO |
YES |
technology |
CMOS |
CMOS |
Temperature level |
COMMERCIAL |
COMMERCIAL |
Terminal surface |
Tin/Lead (Sn/Pb) |
Tin/Lead (Sn/Pb) |
Terminal form |
THROUGH-HOLE |
GULL WING |
Terminal pitch |
2.54 mm |
1.27 mm |
Terminal location |
DUAL |
DUAL |