|
2N7624U3 |
IRHLNJ797034 |
IRHLNJ793034 |
IRHLNJ793034SCS |
Description |
Power Field-Effect Transistor, 22A I(D), 60V, 0.072ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-0.5, 3 PIN |
Power Field-Effect Transistor, 22A I(D), 60V, 0.072ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-0.5, 3 PIN |
Power Field-Effect Transistor, 22A I(D), 60V, 0.072ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, HERMETIC SEALED, CERAMIC, SMD-0.5, 3 PIN |
Power Field-Effect Transistor, 22A I(D), 60V, 0.072ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, |
package instruction |
CHIP CARRIER, R-CBCC-N3 |
CHIP CARRIER, R-CBCC-N3 |
HERMETIC SEALED, CERAMIC, SMD-0.5, 3 PIN |
CHIP CARRIER, R-CBCC-N3 |
Reach Compliance Code |
compli |
compliant |
compliant |
compliant |
Avalanche Energy Efficiency Rating (Eas) |
79 mJ |
79 mJ |
79 mJ |
79 mJ |
Shell connection |
DRAIN |
DRAIN |
DRAIN |
DRAIN |
Configuration |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
SINGLE WITH BUILT-IN DIODE |
Minimum drain-source breakdown voltage |
60 V |
60 V |
60 V |
60 V |
Maximum drain current (ID) |
22 A |
22 A |
22 A |
22 A |
Maximum drain-source on-resistance |
0.072 Ω |
0.072 Ω |
0.072 Ω |
0.072 Ω |
FET technology |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
METAL-OXIDE SEMICONDUCTOR |
JESD-30 code |
R-CBCC-N3 |
R-CBCC-N3 |
R-CBCC-N3 |
R-CBCC-N3 |
Number of components |
1 |
1 |
1 |
1 |
Number of terminals |
3 |
3 |
3 |
3 |
Operating mode |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
ENHANCEMENT MODE |
Package body material |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
CERAMIC, METAL-SEALED COFIRED |
Package shape |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
RECTANGULAR |
Package form |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
CHIP CARRIER |
Polarity/channel type |
P-CHANNEL |
P-CHANNEL |
P-CHANNEL |
P-CHANNEL |
Maximum pulsed drain current (IDM) |
88 A |
88 A |
88 A |
88 A |
surface mount |
YES |
YES |
YES |
YES |
Terminal form |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
Terminal location |
BOTTOM |
BOTTOM |
BOTTOM |
BOTTOM |
transistor applications |
SWITCHING |
SWITCHING |
SWITCHING |
SWITCHING |
Transistor component materials |
SILICON |
SILICON |
SILICON |
SILICON |
Is it Rohs certified? |
incompatible |
incompatible |
incompatible |
- |
ECCN code |
EAR99 |
EAR99 |
EAR99 |
- |
Other features |
LOGIC LEVEL COMPATIBLE |
- |
LOGIC LEVEL COMPATIBLE |
LOGIC LEVEL COMPATIBLE |
Maximum drain current (Abs) (ID) |
22 A |
22 A |
22 A |
- |
JESD-609 code |
e0 |
e0 |
e0 |
- |
Maximum operating temperature |
150 °C |
150 °C |
150 °C |
- |
Peak Reflow Temperature (Celsius) |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Maximum power dissipation(Abs) |
57 W |
57 W |
57 W |
- |
Certification status |
Not Qualified |
Not Qualified |
Not Qualified |
- |
Terminal surface |
TIN LEAD |
Tin/Lead (Sn/Pb) |
TIN LEAD |
- |
Maximum time at peak reflow temperature |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
- |
Maker |
- |
Infineon |
Infineon |
Infineon |