Multiplexer, 4-Func, 2 Line Input, CMOS, CDIP16
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Radiation Semiconductor Corp |
package instruction | DIP, DIP16,.3 |
Reach Compliance Code | unknown |
JESD-30 code | R-XDIP-T16 |
JESD-609 code | e0 |
Load capacitance (CL) | 50 pF |
Logic integrated circuit type | MULTIPLEXER |
MaximumI(ol) | 0.024 A |
Number of functions | 4 |
Number of entries | 2 |
Number of terminals | 16 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP16,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Prop。Delay @ Nom-Sup | 45 ns |
Certification status | Not Qualified |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | MILITARY |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
ZX54HCTLS258J | ZX74HCTLS257N+ | ZX54HCTLS258J+ | ZX74HCTLS258J | ZX74HCTLS258N | |
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Description | Multiplexer, 4-Func, 2 Line Input, CMOS, CDIP16 | Multiplexer, 4-Func, 2 Line Input, CMOS, PDIP16 | Multiplexer, 4-Func, 2 Line Input, CMOS, CDIP16 | Multiplexer, 4-Func, 2 Line Input, CMOS, CDIP16 | Multiplexer, 4-Func, 2 Line Input, CMOS, PDIP16 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Radiation Semiconductor Corp | Radiation Semiconductor Corp | Radiation Semiconductor Corp | Radiation Semiconductor Corp | Radiation Semiconductor Corp |
Reach Compliance Code | unknown | unknown | unknown | unknow | unknow |
JESD-30 code | R-XDIP-T16 | R-PDIP-T16 | R-XDIP-T16 | R-XDIP-T16 | R-PDIP-T16 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 |
Load capacitance (CL) | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
Logic integrated circuit type | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
MaximumI(ol) | 0.024 A | 0.024 A | 0.024 A | 0.024 A | 0.024 A |
Number of functions | 4 | 4 | 4 | 4 | 4 |
Number of entries | 2 | 2 | 2 | 2 | 2 |
Number of terminals | 16 | 16 | 16 | 16 | 16 |
Maximum operating temperature | 125 °C | 85 °C | 125 °C | 85 °C | 85 °C |
Minimum operating temperature | -55 °C | -40 °C | -55 °C | -40 °C | -40 °C |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | CERAMIC | PLASTIC/EPOXY |
encapsulated code | DIP | DIP | DIP | DIP | DIP |
Encapsulate equivalent code | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 | DIP16,.3 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | MILITARY | INDUSTRIAL | MILITARY | INDUSTRIAL | INDUSTRIAL |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL |
package instruction | DIP, DIP16,.3 | - | DIP, DIP16,.3 | DIP, DIP16,.3 | DIP, DIP16,.3 |
Prop。Delay @ Nom-Sup | 45 ns | 37 ns | 45 ns | - | - |
Certification status | Not Qualified | - | - | Not Qualified | Not Qualified |