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CHF5KP13C

Description
Trans Voltage Suppressor Diode, 5000W, 13V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-2
CategoryDiscrete semiconductor    diode   
File Size252KB,3 Pages
ManufacturerMicrosemi
Websitehttps://www.microsemi.com
Download Datasheet Parametric View All

CHF5KP13C Overview

Trans Voltage Suppressor Diode, 5000W, 13V V(RWM), Bidirectional, 1 Element, Silicon, FLIP CHIP-2

CHF5KP13C Parametric

Parameter NameAttribute value
Is it Rohs certified?incompatible
MakerMicrosemi
Parts packaging codeFLIP-CHIP
package instructionR-XUUC-N2
Contacts2
Reach Compliance Codeunknown
ECCN codeEAR99
Minimum breakdown voltage14.4 V
ConfigurationSINGLE
Diode component materialsSILICON
Diode typeTRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 codeR-XUUC-N2
JESD-609 codee0
Maximum non-repetitive peak reverse power dissipation5000 W
Number of components1
Number of terminals2
Maximum operating temperature175 °C
Package body materialUNSPECIFIED
Package shapeRECTANGULAR
Package formUNCASED CHIP
Peak Reflow Temperature (Celsius)NOT SPECIFIED
polarityBIDIRECTIONAL
Maximum power dissipation10 W
Certification statusNot Qualified
Maximum repetitive peak reverse voltage13 V
surface mountYES
technologyAVALANCHE
Terminal surfaceTIN LEAD
Terminal formNO LEAD
Terminal locationUPPER
Maximum time at peak reflow temperatureNOT SPECIFIED
8700 E. Thomas Road
Scottsdale, AZ 85251
Tel: (480) 941-6300
Fax: (480) 947-1503
FLIP CHIP TVS DIODES
CHF5KP5.0
thru
CHF5KP110CA
Patented Flip Chip Series
FEATURES
Unidirectional and bidirectional
Fully glass passivated
5000 watt (10/1000
µs)
Eliminates wire bonding
No overshoot
Provides optimum voltage clamping
MAXIMUM RATINGS MECHANICAL
Max Junction Temperature: 175
0
C
Storage Temperature: -55
0
C to +175
0
C
Flip Chip Peak Pulse Power: 5000 Watts (10/1000
µs)
Maximum non-repetitive peak power 5000 Watts
(10/1000
µs)
Total continuous power dissipation @ T
lead
= 75
0
C 10 W
Turn-on time (theoretical) unidirectional 1X10
-12
Turn-on time (theoretical) bidirectional 1X10
-9
MECHANICAL
Weight: 0.8 grams (approximate)
Cathode mark on top side
Metallization Cr - Ag - Au (Both Sides)
PACKAGING
Waffle package
15 pieces per pack (STANDARD)
BIDIRECTIONAL ALL DIMENSIONS NOMINAL
FLIP CHIP DIMENSIONS
PAD SIZE & CIRCUIT
MSC0997.PDF
ISO 9001 CERTIFIED
REV H 8/18/99

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Datasheet   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z
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