IC,SIMPLE-EPLD,PAL-TYPE,CMOS,DIP,20PIN,CERAMIC
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | SAMSUNG |
package instruction | DIP, DIP20,.3 |
Reach Compliance Code | compliant |
Architecture | PAL-TYPE |
maximum clock frequency | 18 MHz |
JESD-30 code | R-XDIP-T20 |
JESD-609 code | e0 |
Humidity sensitivity level | 3 |
Number of entries | 16 |
Output times | 4 |
Number of product terms | 64 |
Number of terminals | 20 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
Output function | REGISTERED |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 5 V |
Certification status | Not Qualified |
Nominal supply voltage | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |