SRAM Module, 2MX8, 70ns, CMOS, CPGA66, 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66
| Parameter Name | Attribute value |
| Maker | White Electronic Designs Corporation |
| package instruction | 1.385 X 1.385 INCH, HERMETIC SEALED, CERAMIC, HIP-66 |
| Reach Compliance Code | unknown |
| Maximum access time | 70 ns |
| Other features | CONFIGURABLE AS 512K X 32 OR 1024K X 16 |
| JESD-30 code | S-CPGA-P66 |
| length | 35.2 mm |
| memory density | 16777216 bit |
| Memory IC Type | SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 66 |
| word count | 2097152 words |
| character code | 2000000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 2MX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | PGA |
| Package shape | SQUARE |
| Package form | GRID ARRAY |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 5.7 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal form | PIN/PEG |
| Terminal pitch | 2.54 mm |
| Terminal location | PERPENDICULAR |
| width | 35.2 mm |
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