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IRFR430ATRR

Description
5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA
Categorysemiconductor    Discrete semiconductor   
File Size3MB,7 Pages
ManufacturerKersemi Electronic
Websitehttp://www.kersemi.com
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IRFR430ATRR Overview

5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA

IRFR430ATRR Parametric

Parameter NameAttribute value
Number of terminals3
Minimum breakdown voltage500 V
Processing package descriptionLead FREE, plastic, IPAK-3
Lead-freeYes
EU RoHS regulationsYes
stateTRANSFERRED
packaging shapeRectangle
Package SizeIN-line
Terminal formTHROUGH-hole
terminal coatingMATTE Tin OVER Nickel
Terminal locationsingle
Packaging MaterialsPlastic/Epoxy
structureSingle WITH BUILT-IN diode
Shell connectionDRAIN
Number of components1
transistor applicationsswitch
Transistor component materialssilicon
Channel typeN channel
field effect transistor technologyMetal-OXIDE SEMICONDUCTOR
operating modeENHANCEMENT
Transistor typeuniversal power supply
Maximum leakage current5 A
Rated avalanche energy130 mJ
Maximum drain on-resistance1.7 ohm
Maximum leakage current pulse20 A

IRFR430ATRR Related Products

IRFR430ATRR IRFR430ATRLPBFA IRFU430APBF SIHFR430A-E3 SIHFR430ATA
Description 5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA 5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA 5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA 5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA 5 A, 500 V, 1.7 ohm, N-CHANNEL, Si, POWER, MOSFET, TO-251AA
Number of terminals 3 3 3 3 3
Minimum breakdown voltage 500 V 500 V 500 V 500 V 500 V
Processing package description Lead FREE, plastic, IPAK-3 Lead FREE, plastic, IPAK-3 Lead FREE, plastic, IPAK-3 Lead FREE, plastic, IPAK-3 Lead FREE, plastic, IPAK-3
Lead-free Yes Yes Yes Yes Yes
EU RoHS regulations Yes Yes Yes Yes Yes
state TRANSFERRED TRANSFERRED TRANSFERRED TRANSFERRED TRANSFERRED
packaging shape Rectangle Rectangle Rectangle Rectangle Rectangle
Package Size IN-line IN-line IN-line IN-line IN-line
Terminal form THROUGH-hole THROUGH-hole THROUGH-hole THROUGH-hole THROUGH-hole
terminal coating MATTE Tin OVER Nickel MATTE Tin OVER Nickel MATTE Tin OVER Nickel MATTE Tin OVER Nickel MATTE Tin OVER Nickel
Terminal location single single single single single
Packaging Materials Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy Plastic/Epoxy
structure Single WITH BUILT-IN diode Single WITH BUILT-IN diode Single WITH BUILT-IN diode Single WITH BUILT-IN diode Single WITH BUILT-IN diode
Shell connection DRAIN DRAIN DRAIN DRAIN DRAIN
Number of components 1 1 1 1 1
transistor applications switch switch switch switch switch
Transistor component materials silicon silicon silicon silicon silicon
Channel type N channel N channel N channel N channel N channel
field effect transistor technology Metal-OXIDE SEMICONDUCTOR Metal-OXIDE SEMICONDUCTOR Metal-OXIDE SEMICONDUCTOR Metal-OXIDE SEMICONDUCTOR Metal-OXIDE SEMICONDUCTOR
operating mode ENHANCEMENT ENHANCEMENT ENHANCEMENT ENHANCEMENT ENHANCEMENT
Transistor type universal power supply universal power supply universal power supply universal power supply universal power supply
Maximum leakage current 5 A 5 A 5 A 5 A 5 A
Rated avalanche energy 130 mJ 130 mJ 130 mJ 130 mJ 130 mJ
Maximum drain on-resistance 1.7 ohm 1.7 ohm 1.7 ohm 1.7 ohm 1.7 ohm
Maximum leakage current pulse 20 A 20 A 20 A 20 A 20 A

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