Flash, 512KX32, 54ns, PQFP80, LEAD FREE, PLASTIC, MO-108CB-1, QFP-80
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | SPANSION |
Parts packaging code | QFP |
package instruction | QFP, QFP80,.7X.9,32 |
Contacts | 80 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Maximum access time | 54 ns |
Other features | SYNCHRONOUS BURST MODE OPERATION ALSO POSSIBLE; BOTTOM BOOT BLOCK |
startup block | BOTTOM |
command user interface | YES |
Universal Flash Interface | YES |
Data polling | YES |
JESD-30 code | R-PQFP-G80 |
JESD-609 code | e3 |
length | 20 mm |
memory density | 16777216 bit |
Memory IC Type | FLASH |
memory width | 32 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of departments/size | 16,30 |
Number of terminals | 80 |
word count | 524288 words |
character code | 512000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX32 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP80,.7X.9,32 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 1.8/2.6,2.6 V |
Programming voltage | 2.7 V |
Certification status | Not Qualified |
ready/busy | YES |
Maximum seat height | 3.35 mm |
Department size | 2K,16K |
Maximum standby current | 0.00006 A |
Maximum slew rate | 0.09 mA |
Maximum supply voltage (Vsup) | 2.75 V |
Minimum supply voltage (Vsup) | 2.5 V |
Nominal supply voltage (Vsup) | 2.6 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | Matte Tin (Sn) |
Terminal form | GULL WING |
Terminal pitch | 0.8 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | 40 |
switch bit | YES |
type | NOR TYPE |
width | 14 mm |