5962-88565022C datasheet, PDF - EEWORLD Datasheet

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5962-88565022C: DescriptionOperational Amplifier, 4 Func, 1200uV Offset-Max, BIPolar, CQCC20, CERAMIC, LCC-20; CategoryAnalog mixed-signal IC Amplifier circuit; File Size79KB，13 Pages; ManufacturerPrecision Monolithics Inc

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5962-88565022C Overview

Operational Amplifier, 4 Func, 1200uV Offset-Max, BIPolar, CQCC20, CERAMIC, LCC-20

5962-88565022C Parametric

Parameter Name	Attribute value
Maker	Precision Monolithics Inc
package instruction	CERAMIC, LCC-20
Reach Compliance Code	unknown
Amplifier type	OPERATIONAL AMPLIFIER
Maximum average bias current (IIB)	0.05 µA
Nominal Common Mode Rejection Ratio	100 dB
Maximum input offset voltage	1200 µV
JESD-30 code	S-CQCC-N20
JESD-609 code	e0
length	8.89 mm
Negative supply voltage upper limit	-18 V
Nominal Negative Supply Voltage (Vsup)	-15 V
Number of functions	4
Number of terminals	20
Maximum operating temperature	125 °C
Minimum operating temperature	-55 °C
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	QCCN
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
Certification status	Not Qualified
Filter level	MIL-STD-883
Maximum seat height	2.54 mm
Nominal slew rate	8 V/us
Supply voltage upper limit	18 V
Nominal supply voltage (Vsup)	15 V
surface mount	YES
technology	BIPOLAR
Temperature level	MILITARY
Terminal surface	TIN LEAD
Terminal form	NO LEAD
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	NOT SPECIFIED
Nominal Uniform Gain Bandwidth	6500 kHz
width	8.89 mm

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REVISIONS

LTR

DESCRIPTION

Add case outline 2 for device types 01 and 02. Update format. Editorial

changes throughout.

Changes to large-signal voltage gain test and to the output voltage swing test.

Changes IAW NOR 5962-R193-93.

Add case outline K. Change boilerplate to add one-part part numbers.

Add delta test limits. Redrawn.

Add radiation hardness requirements. Update boilerplate. -rrp

Change to the slew rate test condition A

VCL

in table I. -rrp

Add case outline D. Remove radiation exposure circuit. Changes made to

1.2.4, 1.3, 3.2.3, figure 1, and table IIA. Update boilerplate to reflect current

requirements. -rrp

Update drawing to current requirements. Deleted unused group E boilerplate

paragraphs. –rrp

Add device types 03 and 04 tested at low dose rate. Make changes to 1.2.2,

1.5, Table I, figure 1, Table IIB, 4.4.4.1. - ro

Update document paragraphs to current MIL-PRF-385345 requirements. - ro

DATE (YR-MO-DA)

89-11-07

93-08-26

96-11-25

98-06-19

00-10-04

03-03-19

11-04-06

11-11-16

17-11-06

APPROVED

M. A. Frye

R. Monnin

C. Saffle

C. SAFFLE

THE ORIGINAL FIRST SHEET OF THIS DRAWING HAS BEEN REPLACED.

REV

SHEET

REV

SHEET

REV STATUS

OF SHEETS

PMIC N/A

REV

SHEET

PREPARED BY

Gary Zahn

STANDARD

MICROCIRCUIT

DRAWING

THIS DRAWING IS AVAILABLE

FOR USE BY ALL

DEPARTMENTS

AND AGENCIES OF THE

DEPARTMENT OF DEFENSE

CHECKED BY

Ray Monnin

APPROVED BY

Michael A. Frye

DRAWING APPROVAL DATE

88-08-18

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

http://www.dla.mil/landandmaritime

MICROCIRCUIT, LINEAR, RADIATION

HARDENED, LOW NOISE, QUAD OPERATIONAL

AMPLIFIER, MONOLITHIC SILICON

SIZE

CAGE CODE

AMSC N/A

REVISION LEVEL

67268

SHEET

1 OF 11

5962-88565

DSCC FORM 2233

APR 97

5962-E427-17

DISTRIBUTION STATEMENT A. Approved for public release.

Distribution is unlimited

1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:

Outline letter

Descriptive designator

GDIP1-T14 or CDIP2-T14

GDFP1-F14 or CDFP2-F14

CQCC1-N20

CQCC1-N28

GDFP2-F24 or CDFP3-F24

Terminals

Package style

Dual-in-line

Flat pack

Square leadless chip carrier

Flat pack

1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535,

appendix A for device class M.

1.3 Absolute maximum ratings. 1/

Supply voltage (V

) .................................................................................................

Differential input voltage ............................................................................................

Differential input current ............................................................................................

Input voltage ..............................................................................................................

Output short circuit duration .......................................................................................

Storage temperature range .......................................................................................

Lead temperature (soldering, 60 seconds) ................................................................

Power dissipation (P

Cases C and 2 .......................................................................................................

Case D ...................................................................................................................

Case 3 ....................................................................................................................

Case K ...................................................................................................................

Maximum junction temperature (T

) ..........................................................................

Thermal resistance, junction-to-ambient (

Cases C and 2 .......................................................................................................

Case D ...................................................................................................................

Case 3 ....................................................................................................................

Case K ...................................................................................................................

1.4 Recommended operating conditions.

Ambient operating temperature range (T

) ............................................................. -55C to +125C

Supply voltage (V

) ...............................................................................................

15

1.5 Radiation features.

Device types 01 and 02:

Maximum total dose available (dose rate = 50 – 300 rads(Si)/s) ......................... 100 krads(Si) 3/

Device types 03 and 04:

Maximum total dose available (dose rate



10 mrads(Si)/s) ................................ 50 krads (Si) 4/

18

V dc

1

V dc 2/

25

mA 2/

Supply voltage

Continuous

-65C to +150C

+300C

800 mW

550 mW

500 mW

440 mW

+150C

Thermal resistance, junction-to-case (

) ................................................................ See MIL-STD-1835

100C/W

140C/W

110C/W

69C/W

Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the

maximum levels may degrade performance and affect reliability.

The inputs are protected by back-to-back diodes. Current limiting resistors are not used in order to achieve low noise

performance. If the differential input voltage exceeds

1

V, the input current should be limited to

25

mA.

Device types 01 and 02 may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate

effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in

MIL-STD-883, method 1019, condition A.

For device type 03 and 04, radiation end point limits for the noted parameters are guaranteed for the conditions specified

in MIL-STD-883, method 1019, condition D.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88565

SHEET

2. APPLICABLE DOCUMENTS

2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part

of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the

solicitation or contract.

DEPARTMENT OF DEFENSE SPECIFICATION

MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for.

DEPARTMENT OF DEFENSE STANDARDS

MIL-STD-883 -

MIL-STD-1835 -

Test Method Standard Microcircuits.

Interface Standard Electronic Component Case Outlines.

DEPARTMENT OF DEFENSE HANDBOOKS

MIL-HDBK-103 -

MIL-HDBK-780 -

List of Standard Microcircuit Drawings.

Standard Microcircuit Drawings.

(Copies of these documents are available online at

http://quicksearch.dla.mil

or from the Standardization Document Order

Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)

2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text

of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a

specific exemption has been obtained.

3. REQUIREMENTS

3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with

MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The

modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for

device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified

herein.

3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified

in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M.

3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein.

3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1.

3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document

revision level control and shall be made available to the preparing and acquiring activity upon request.

3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the

electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full

ambient operating temperature range.

3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical

tests for each subgroup are defined in table I.

3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be

marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer

has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be

marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be

in accordance with MIL-PRF-38535, appendix A.

STANDARD

MICROCIRCUIT DRAWING

DLA LAND AND MARITIME

COLUMBUS, OHIO 43218-3990

DSCC FORM 2234

APR 97

SIZE

REVISION LEVEL

5962-88565

SHEET

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