TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal
Parameter Name | Attribute value |
Is it Rohs certified? | conform to |
Maker | NXP |
Parts packaging code | SOT-23 |
package instruction | PLASTIC PACKAGE-3 |
Contacts | 3 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Configuration | SINGLE |
Minimum drain-source breakdown voltage | 25 V |
Maximum drain-source on-resistance | 12 Ω |
FET technology | JUNCTION |
Maximum feedback capacitance (Crss) | 15 pF |
JEDEC-95 code | TO-236AB |
JESD-30 code | R-PDSO-G3 |
JESD-609 code | e3 |
Number of components | 1 |
Number of terminals | 3 |
Operating mode | DEPLETION MODE |
Maximum operating temperature | 150 °C |
Package body material | PLASTIC/EPOXY |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Peak Reflow Temperature (Celsius) | 260 |
Polarity/channel type | N-CHANNEL |
Maximum power dissipation(Abs) | 0.25 W |
Certification status | Not Qualified |
surface mount | YES |
Terminal surface | TIN |
Terminal form | GULL WING |
Terminal location | DUAL |
Maximum time at peak reflow temperature | 40 |
transistor applications | SWITCHING |
Transistor component materials | SILICON |
PMBFJ109T/R | PMBFJ108,215 | PMBFJ109,215 | PMBFJ110,215 | PMBFJ110T/R | PMBFJ108T/R | PMBFJ108-T | PMBFJ110-T | PMBFJ109-T | |
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Description | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal | JFET N-CH 25V 250MW SOT23 | JFET N-CH 25V 250MW SOT23 | JFET N-CH 25V 250MW SOT23 | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal | TRANSISTOR 25 V, N-CHANNEL, Si, SMALL SIGNAL, JFET, TO-236AB, PLASTIC PACKAGE-3, FET General Purpose Small Signal |
Maker | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP | NXP |
Parts packaging code | SOT-23 | TO-236 | TO-236 | TO-236 | SOT-23 | SOT-23 | SOT-23 | SOT-23 | SOT-23 |
package instruction | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | PLASTIC PACKAGE-3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 | SMALL OUTLINE, R-PDSO-G3 |
Contacts | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Reach Compliance Code | unknown | compliant | compliant | compliant | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Configuration | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE | SINGLE |
Minimum drain-source breakdown voltage | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V | 25 V |
Maximum drain-source on-resistance | 12 Ω | 8 Ω | 12 Ω | 18 Ω | 18 Ω | 8 Ω | 8 Ω | 18 Ω | 12 Ω |
FET technology | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION | JUNCTION |
Maximum feedback capacitance (Crss) | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF | 15 pF |
JEDEC-95 code | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB | TO-236AB |
JESD-30 code | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 | R-PDSO-G3 |
Number of components | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
Operating mode | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE | DEPLETION MODE |
Maximum operating temperature | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C | 150 °C |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Polarity/channel type | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL | N-CHANNEL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
surface mount | YES | YES | YES | YES | YES | YES | YES | YES | YES |
Terminal form | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
transistor applications | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING | SWITCHING |
Transistor component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Is it Rohs certified? | conform to | conform to | conform to | conform to | conform to | conform to | - | - | - |
JESD-609 code | e3 | e3 | e3 | e3 | e3 | e3 | - | - | - |
Peak Reflow Temperature (Celsius) | 260 | 260 | 260 | 260 | 260 | 260 | - | - | - |
Maximum power dissipation(Abs) | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | 0.25 W | - | - | - |
Terminal surface | TIN | Tin (Sn) | TIN | Tin (Sn) | TIN | TIN | - | - | - |
Maximum time at peak reflow temperature | 40 | 40 | NOT SPECIFIED | 40 | 40 | 40 | - | - | - |