Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | FUJITSU |
Parts packaging code | DIP |
package instruction | DIP, DIP20,.3 |
Contacts | 20 |
Reach Compliance Code | unknown |
Maximum access time | 100 ns |
I/O type | COMMON |
JESD-30 code | R-XDIP-T20 |
JESD-609 code | e0 |
memory density | 1048576 bit |
Memory IC Type | FAST PAGE DRAM |
memory width | 4 |
Number of terminals | 20 |
word count | 262144 words |
character code | 256000 |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 256KX4 |
Output characteristics | 3-STATE |
Package body material | CERAMIC |
encapsulated code | DIP |
Encapsulate equivalent code | DIP20,.3 |
Package shape | RECTANGULAR |
Package form | IN-LINE |
power supply | 5 V |
Certification status | Not Qualified |
refresh cycle | 512 |
Maximum standby current | 0.00025 A |
Maximum slew rate | 0.055 mA |
Nominal supply voltage (Vsup) | 5 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | THROUGH-HOLE |
Terminal pitch | 2.54 mm |
Terminal location | DUAL |
MB81C4256-10LC | MB81C4256-70LPJ | MB81C4256-80LC | MB81C4256-10LPSZ | MB81C4256-80LP | MB81C4256-80LPJ | MB81C4256-10LPJ | |
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Description | Fast Page DRAM, 256KX4, 100ns, CMOS, CDIP20 | Fast Page DRAM, 256KX4, 70ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 80ns, CMOS, CDIP20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PZIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDIP20 | Fast Page DRAM, 256KX4, 80ns, CMOS, PDSO20 | Fast Page DRAM, 256KX4, 100ns, CMOS, PDSO20, PLASTIC, LCC-26/20 |
package instruction | DIP, DIP20,.3 | SOJ, SOJ20/26,.34 | DIP, DIP20,.3 | ZIP, ZIP20,.1 | DIP, DIP20,.3 | SOJ, SOJ20/26,.34 | SOJ, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
Maximum access time | 100 ns | 70 ns | 80 ns | 100 ns | 80 ns | 80 ns | 100 ns |
JESD-30 code | R-XDIP-T20 | R-PDSO-J20 | R-XDIP-T20 | R-PZIP-T20 | R-PDIP-T20 | R-PDSO-J20 | R-PDSO-J20 |
memory density | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
Memory IC Type | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM | FAST PAGE DRAM |
memory width | 4 | 4 | 4 | 4 | 4 | 4 | 4 |
Number of terminals | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
word count | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
character code | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 | 256KX4 |
Package body material | CERAMIC | PLASTIC/EPOXY | CERAMIC | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | DIP | SOJ | DIP | ZIP | DIP | SOJ | SOJ |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | IN-LINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 512 | 512 | 512 | 512 | 512 | 512 | 512 |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | NO | YES | NO | NO | NO | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | THROUGH-HOLE | J BEND | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | J BEND | J BEND |
Terminal pitch | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | ZIG-ZAG | DUAL | DUAL | DUAL |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - |
Maker | FUJITSU | - | FUJITSU | FUJITSU | FUJITSU | FUJITSU | - |
Parts packaging code | DIP | LCC | DIP | ZIP | DIP | LCC | - |
Contacts | 20 | 26/20 | 20 | 20 | 20 | 26/20 | - |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | - |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | - |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | - |
Encapsulate equivalent code | DIP20,.3 | SOJ20/26,.34 | DIP20,.3 | ZIP20,.1 | DIP20,.3 | SOJ20/26,.34 | - |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | - |
Maximum standby current | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | 0.00025 A | - |
Maximum slew rate | 0.055 mA | 0.072 mA | 0.065 mA | 0.055 mA | 0.065 mA | 0.065 mA | - |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - |