EDO DRAM Module, 1MX64, 52ns, CMOS, DIMM-168
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Micron Technology |
Parts packaging code | DIMM |
package instruction | DIMM-168 |
Contacts | 168 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
access mode | FAST PAGE WITH EDO |
Maximum access time | 52 ns |
Other features | RAS ONLY/CAS BEFORE RAS REFRESH |
Spare memory width | 32 |
I/O type | COMMON |
JESD-30 code | R-XDMA-N168 |
memory density | 67108864 bit |
Memory IC Type | EDO DRAM MODULE |
memory width | 64 |
Humidity sensitivity level | 1 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 168 |
word count | 1048576 words |
character code | 1000000 |
Operating mode | ASYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1MX64 |
Output characteristics | 3-STATE |
Package body material | UNSPECIFIED |
encapsulated code | DIMM |
Encapsulate equivalent code | DIMM168 |
Package shape | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 3.3 V |
Certification status | Not Qualified |
refresh cycle | 1024 |
Maximum seat height | 25.654 mm |
Maximum standby current | 0.002 A |
Maximum slew rate | 0.76 mA |
Maximum supply voltage (Vsup) | 3.47 V |
Minimum supply voltage (Vsup) | 3.13 V |
Nominal supply voltage (Vsup) | 3.3 V |
surface mount | NO |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal form | NO LEAD |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
MT4LDT164AG-52B | MT16LD464AG-52B | MT8LD264AG-52B | MT16LD464AG-60B | MT4LDT164AG-60B | MT8LD264AG-60B | MT4LD164AG-52B | MT4LD164AG-60B | |
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Description | EDO DRAM Module, 1MX64, 52ns, CMOS, DIMM-168 | EDO DRAM Module, 4MX64, 52ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 52ns, CMOS, DIMM-168 | EDO DRAM Module, 4MX64, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 1MX64, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 2MX64, 60ns, CMOS, DIMM-168 | EDO DRAM Module, 1MX64, 52ns, CMOS, DIMM-168 | EDO DRAM Module, 1MX64, 60ns, CMOS, DIMM-168 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
Parts packaging code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
package instruction | DIMM-168 | DIMM-168 | DIMM-168 | DIMM-168 | DIMM-168 | DIMM-168 | DIMM-168 | DIMM-168 |
Contacts | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO | FAST PAGE WITH EDO |
Maximum access time | 52 ns | 52 ns | 52 ns | 60 ns | 60 ns | 60 ns | 52 ns | 60 ns |
Other features | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH | RAS ONLY/CAS BEFORE RAS REFRESH |
Spare memory width | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
JESD-30 code | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 | R-XDMA-N168 |
memory density | 67108864 bit | 268435456 bit | 134217728 bit | 268435456 bit | 67108864 bit | 134217728 bit | 67108864 bit | 67108864 bit |
Memory IC Type | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE | EDO DRAM MODULE |
memory width | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 168 | 168 | 168 | 168 | 168 | 168 | 168 | 168 |
word count | 1048576 words | 4194304 words | 2097152 words | 4194304 words | 1048576 words | 2097152 words | 1048576 words | 1048576 words |
character code | 1000000 | 4000000 | 2000000 | 4000000 | 1000000 | 2000000 | 1000000 | 1000000 |
Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
organize | 1MX64 | 4MX64 | 2MX64 | 4MX64 | 1MX64 | 2MX64 | 1MX64 | 1MX64 |
Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
encapsulated code | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM | DIMM |
Encapsulate equivalent code | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 | DIMM168 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
Peak Reflow Temperature (Celsius) | 225 | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
power supply | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
refresh cycle | 1024 | 2048 | 2048 | 2048 | 1024 | 2048 | 1024 | 1024 |
Maximum seat height | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm | 25.654 mm |
Maximum standby current | 0.002 A | 0.008 A | 0.004 A | 0.008 A | 0.002 A | 0.004 A | 0.002 A | 0.002 A |
Maximum slew rate | 0.76 mA | 2.08 mA | 1.12 mA | 1.92 mA | 0.64 mA | 1.04 mA | 0.76 mA | 0.64 mA |
Maximum supply voltage (Vsup) | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V | 3.47 V |
Minimum supply voltage (Vsup) | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V | 3.13 V |
Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
surface mount | NO | NO | NO | NO | NO | NO | NO | NO |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
Terminal pitch | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |