NAND02GAH0IZC5E datasheet, PDF

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NAND02GAH0IZC5E: DescriptionFlash, 256MX8, PBGA153, 11.50 X 13 MM, 1.30 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-153; Categorystorage storage; File Size630KB，30 Pages; ManufacturerNumonyx ( Micron ); Websitehttps://www.micron.com; Environmental Compliance

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NAND02GAH0IZC5E Overview

Flash, 256MX8, PBGA153, 11.50 X 13 MM, 1.30 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-153

NAND02GAH0IZC5E Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Numonyx ( Micron )
Parts packaging code	BGA
package instruction	LFBGA, BGA153,14X14,20
Contacts	153
Reach Compliance Code	unknown
ECCN code	3A991.B.1.A
JESD-30 code	R-PBGA-B153
length	13 mm
memory density	2147483648 bit
Memory IC Type	FLASH
memory width	8
Number of functions	1
Number of terminals	153
word count	268435456 words
character code	256000000
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	256MX8
Package body material	PLASTIC/EPOXY
encapsulated code	LFBGA
Encapsulate equivalent code	BGA153,14X14,20
Package shape	RECTANGULAR
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED
power supply	1.8/3.3,3.3 V
Programming voltage	3.3 V
Certification status	Not Qualified
Maximum seat height	1.3 mm
Maximum supply voltage (Vsup)	3.465 V
Minimum supply voltage (Vsup)	3.135 V
Nominal supply voltage (Vsup)	3.3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.5 mm
Terminal location	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED
type	SLC NAND TYPE
width	11.5 mm

NAND02GAH0IZC5E Related Products

	NAND02GAH0IZC5E	NAND08GAH0FZC5E	NAND02GAH0IZC5F	NAND08GAH0FZC5F
Description	Flash, 256MX8, PBGA153, 11.50 X 13 MM, 1.30 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-153	Flash, 1GX8, PBGA153, 11.50 X 13 MM, 1.30 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-153	Flash, 256MX8, PBGA153, 11.50 X 13 MM, 1.30 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-153	Flash, 1GX8, PBGA153, 11.50 X 13 MM, 1.30 MM HEIGHT, 0.50 MM PITCH, ROHS COMPLIANT, LFBGA-153
Is it lead-free?	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to
Parts packaging code	BGA	BGA	BGA	BGA
package instruction	LFBGA, BGA153,14X14,20	LFBGA, BGA153,14X14,20	LFBGA, BGA153,14X14,20	LFBGA, BGA153,14X14,20
Contacts	153	153	153	153
Reach Compliance Code	unknown	unknown	unknow	unknow
ECCN code	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A	3A991.B.1.A
JESD-30 code	R-PBGA-B153	R-PBGA-B153	R-PBGA-B153	R-PBGA-B153
length	13 mm	13 mm	13 mm	13 mm
memory density	2147483648 bit	8589934592 bit	2147483648 bi	8589934592 bi
Memory IC Type	FLASH	FLASH	FLASH	FLASH
memory width	8	8	8	8
Number of functions	1	1	1	1
Number of terminals	153	153	153	153
word count	268435456 words	1073741824 words	268435456 words	1073741824 words
character code	256000000	1000000000	256000000	1000000000
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C
organize	256MX8	1GX8	256MX8	1GX8
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	LFBGA	LFBGA	LFBGA	LFBGA
Encapsulate equivalent code	BGA153,14X14,20	BGA153,14X14,20	BGA153,14X14,20	BGA153,14X14,20
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
power supply	1.8/3.3,3.3 V	1.8/3.3,3.3 V	1.8/3.3,3.3 V	1.8/3.3,3.3 V
Programming voltage	3.3 V	3.3 V	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.3 mm	1.3 mm	1.3 mm	1.3 mm
Maximum supply voltage (Vsup)	3.465 V	3.465 V	3.465 V	3.465 V
Minimum supply voltage (Vsup)	3.135 V	3.135 V	3.135 V	3.135 V
Nominal supply voltage (Vsup)	3.3 V	3.3 V	3.3 V	3.3 V
surface mount	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	BALL	BALL
Terminal pitch	0.5 mm	0.5 mm	0.5 mm	0.5 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	11.5 mm	11.5 mm	11.5 mm	11.5 mm
Maker	Numonyx ( Micron )	-	Numonyx ( Micron )	Numonyx ( Micron )
type	SLC NAND TYPE	-	SLC NAND TYPE	SLC NAND TYPE

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