Trans Voltage Suppressor Diode, 200W, 24V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | ProTek Devices |
Parts packaging code | FLIP-CHIP |
package instruction | R-XBGA-B6 |
Contacts | 6 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
Other features | LOW LEAKAGE CURRENT |
Minimum breakdown voltage | 26.7 V |
Maximum clamping voltage | 50.6 V |
Configuration | COMMON CATHODE, 6 ELEMENTS |
Diode component materials | SILICON |
Diode type | TRANS VOLTAGE SUPPRESSOR DIODE |
JESD-30 code | R-XBGA-B6 |
JESD-609 code | e0 |
Humidity sensitivity level | 1 |
Maximum non-repetitive peak reverse power dissipation | 200 W |
Number of components | 6 |
Number of terminals | 6 |
Package body material | UNSPECIFIED |
Package shape | RECTANGULAR |
Package form | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 |
polarity | BIDIRECTIONAL |
Certification status | Not Qualified |
Maximum repetitive peak reverse voltage | 24 V |
surface mount | YES |
technology | AVALANCHE |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | BALL |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
LC0406FC24C-T75-1 | LC0406FC3.3C-T75-1 | LC0406FC12C-T75-1 | LC0406FC15C-T75-1 | LC0406FC05C-T75-1 | LC0406FC36C-T75-1 | LC0406FC08C-T75-1 | |
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Description | Trans Voltage Suppressor Diode, 200W, 24V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 | Trans Voltage Suppressor Diode, 200W, 3.3V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 | Trans Voltage Suppressor Diode, 200W, 12V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 | Trans Voltage Suppressor Diode, 200W, 15V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 | Trans Voltage Suppressor Diode, 200W, 5.9V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 | Trans Voltage Suppressor Diode, 200W, 36V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 | Trans Voltage Suppressor Diode, 200W, 8V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Parts packaging code | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP | FLIP-CHIP |
package instruction | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 |
Contacts | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Other features | LOW LEAKAGE CURRENT | LOW LEAKAGE CURRENT | LOW LEAKAGE CURRENT | LOW LEAKAGE CURRENT | LOW LEAKAGE CURRENT | LOW LEAKAGE CURRENT | LOW LEAKAGE CURRENT |
Minimum breakdown voltage | 26.7 V | 4 V | 13.3 V | 16.7 V | 6 V | 40 V | 8.5 V |
Maximum clamping voltage | 50.6 V | 12.5 V | 26.9 V | 34.5 V | 13 V | 80 V | 18 V |
Configuration | COMMON CATHODE, 6 ELEMENTS | COMMON CATHODE, 6 ELEMENTS | COMMON CATHODE, 6 ELEMENTS | COMMON CATHODE, 6 ELEMENTS | COMMON CATHODE, 6 ELEMENTS | COMMON CATHODE, 6 ELEMENTS | COMMON CATHODE, 6 ELEMENTS |
Diode component materials | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON | SILICON |
Diode type | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE | TRANS VOLTAGE SUPPRESSOR DIODE |
JESD-30 code | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 | R-XBGA-B6 |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
Humidity sensitivity level | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Maximum non-repetitive peak reverse power dissipation | 200 W | 200 W | 200 W | 200 W | 200 W | 200 W | 200 W |
Number of components | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
Number of terminals | 6 | 6 | 6 | 6 | 6 | 6 | 6 |
Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
Peak Reflow Temperature (Celsius) | 245 | 245 | 245 | 245 | 245 | 245 | 245 |
polarity | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL | BIDIRECTIONAL |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum repetitive peak reverse voltage | 24 V | 3.3 V | 12 V | 15 V | 5.9 V | 36 V | 8 V |
surface mount | YES | YES | YES | YES | YES | YES | YES |
technology | AVALANCHE | AVALANCHE | AVALANCHE | AVALANCHE | AVALANCHE | AVALANCHE | AVALANCHE |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Maker | ProTek Devices | - | - | ProTek Devices | ProTek Devices | ProTek Devices | ProTek Devices |