TQFP-128, Tray
Parameter Name | Attribute value |
Brand Name | Integrated Device Technology |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | IDT (Integrated Device Technology) |
Parts packaging code | TQFP |
Contacts | 128 |
Manufacturer packaging code | PK128 |
Reach Compliance Code | not_compliant |
ECCN code | EAR99 |
Maximum access time | 12 ns |
Maximum clock frequency (fCLK) | 50 MHz |
JESD-30 code | R-PQFP-G128 |
JESD-609 code | e0 |
memory density | 73728 bit |
Memory IC Type | OTHER FIFO |
memory width | 36 |
Humidity sensitivity level | 3 |
Number of terminals | 128 |
word count | 2048 words |
character code | 2000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 2KX36 |
Package body material | PLASTIC/EPOXY |
encapsulated code | QFP |
Encapsulate equivalent code | QFP128,.63X.87,20 |
Package shape | RECTANGULAR |
Package form | FLATPACK |
Peak Reflow Temperature (Celsius) | 225 |
power supply | 5 V |
Certification status | Not Qualified |
Maximum standby current | 0.001 A |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING |
Terminal pitch | 0.5 mm |
Terminal location | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED |
723653L20PF | 723663L20PF | |
---|---|---|
Description | TQFP-128, Tray | FIFO, 4KX36, 12ns, Synchronous, CMOS, PQFP128 |
Is it lead-free? | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible |
Reach Compliance Code | not_compliant | not_compliant |
ECCN code | EAR99 | EAR99 |
Maximum access time | 12 ns | 12 ns |
Maximum clock frequency (fCLK) | 50 MHz | 50 MHz |
JESD-30 code | R-PQFP-G128 | R-PQFP-G128 |
JESD-609 code | e0 | e0 |
memory density | 73728 bit | 147456 bit |
Memory IC Type | OTHER FIFO | OTHER FIFO |
memory width | 36 | 36 |
Humidity sensitivity level | 3 | 3 |
Number of terminals | 128 | 128 |
word count | 2048 words | 4096 words |
character code | 2000 | 4000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C |
organize | 2KX36 | 4KX36 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | QFP | QFP |
Encapsulate equivalent code | QFP128,.63X.87,20 | QFP128,.63X.87,20 |
Package shape | RECTANGULAR | RECTANGULAR |
Package form | FLATPACK | FLATPACK |
Peak Reflow Temperature (Celsius) | 225 | 260 |
power supply | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified |
Maximum standby current | 0.001 A | 0.001 A |
Nominal supply voltage (Vsup) | 5 V | 5 V |
surface mount | YES | YES |
technology | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL |
Terminal surface | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
Terminal form | GULL WING | GULL WING |
Terminal pitch | 0.5 mm | 0.5 mm |
Terminal location | QUAD | QUAD |
Maximum time at peak reflow temperature | NOT SPECIFIED | 6 |