Cache SRAM, 512KX72, 7.5ns, CMOS, PBGA209, 14 X 22 MM, 1 MM PITCH, ROHS COMPLIANT, BGA-209
Parameter Name | Attribute value |
Is it lead-free? | Lead free |
Is it Rohs certified? | conform to |
Maker | GSI Technology |
Parts packaging code | BGA |
package instruction | LBGA, BGA209,11X19,40 |
Contacts | 209 |
Reach Compliance Code | compliant |
ECCN code | 3A991.B.2.B |
Maximum access time | 7.5 ns |
Other features | FLOW-THROUGH OR PIPELINED ARCHITECTURE; ALSO OPERATES AT 3.3V SUPPLY |
Maximum clock frequency (fCLK) | 200 MHz |
I/O type | COMMON |
JESD-30 code | R-PBGA-B209 |
JESD-609 code | e1 |
length | 22 mm |
memory density | 37748736 bit |
Memory IC Type | CACHE SRAM |
memory width | 72 |
Humidity sensitivity level | 3 |
Number of functions | 1 |
Number of terminals | 209 |
word count | 524288 words |
character code | 512000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 85 °C |
Minimum operating temperature | -40 °C |
organize | 512KX72 |
Output characteristics | 3-STATE |
Package body material | PLASTIC/EPOXY |
encapsulated code | LBGA |
Encapsulate equivalent code | BGA209,11X19,40 |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, LOW PROFILE |
Parallel/Serial | PARALLEL |
Peak Reflow Temperature (Celsius) | 260 |
power supply | 2.5/3.3 V |
Certification status | Not Qualified |
Maximum seat height | 1.7 mm |
Maximum standby current | 0.08 A |
Minimum standby current | 2.38 V |
Maximum slew rate | 0.34 mA |
Maximum supply voltage (Vsup) | 2.7 V |
Minimum supply voltage (Vsup) | 2.3 V |
Nominal supply voltage (Vsup) | 2.5 V |
surface mount | YES |
technology | CMOS |
Temperature level | INDUSTRIAL |
Terminal surface | TIN SILVER COPPER |
Terminal form | BALL |
Terminal pitch | 1 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 14 mm |