Operational Amplifier, 1 Func, 300uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8
Parameter Name | Attribute value |
Maker | Harris |
package instruction | DIP, |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Amplifier type | OPERATIONAL AMPLIFIER |
Maximum average bias current (IIB) | 0.15 µA |
Nominal Common Mode Rejection Ratio | 100 dB |
Maximum input offset voltage | 300 µV |
JESD-30 code | R-GDIP-T8 |
JESD-609 code | e0 |
Negative supply voltage upper limit | -22 V |
Nominal Negative Supply Voltage (Vsup) | -15 V |
Number of functions | 1 |
Number of terminals | 8 |
Maximum operating temperature | 125 °C |
Minimum operating temperature | -55 °C |
Package body material | CERAMIC, GLASS-SEALED |
encapsulated code | DIP |
Package shape | RECTANGULAR |
Package form | IN-LINE |
Certification status | Not Qualified |
Supply voltage upper limit | 22 V |
Nominal supply voltage (Vsup) | 15 V |
surface mount | NO |
technology | BIPOLAR |
Temperature level | MILITARY |
Terminal surface | TIN LEAD |
Terminal form | THROUGH-HOLE |
Terminal location | DUAL |
5962-8962701PA | 5962-89627012X | 5962-8962701PX | 5962-89627012A | |
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Description | Operational Amplifier, 1 Func, 300uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8 | Operational Amplifier, 1 Func, 300uV Offset-Max, CQCC20, CERAMIC, LCC-20 | Operational Amplifier, 1 Func, 300uV Offset-Max, BIPolar, CDIP8, CERAMIC, DIP-8 | Operational Amplifier, 1 Func, 300uV Offset-Max, CQCC20, CERAMIC, LCC-20 |
Maker | Harris | Harris | Harris | Harris |
package instruction | DIP, | QCCN, | DIP, | QCCN, |
Reach Compliance Code | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 |
Amplifier type | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER | OPERATIONAL AMPLIFIER |
Maximum average bias current (IIB) | 0.15 µA | 0.15 µA | 0.15 µA | 0.15 µA |
Nominal Common Mode Rejection Ratio | 100 dB | 100 dB | 100 dB | 100 dB |
Maximum input offset voltage | 300 µV | 300 µV | 300 µV | 300 µV |
JESD-30 code | R-GDIP-T8 | S-CQCC-N20 | R-GDIP-T8 | S-CQCC-N20 |
Negative supply voltage upper limit | -22 V | -22 V | -22 V | -22 V |
Nominal Negative Supply Voltage (Vsup) | -15 V | -15 V | -15 V | -15 V |
Number of functions | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 20 | 8 | 20 |
Maximum operating temperature | 125 °C | 125 °C | 125 °C | 125 °C |
Minimum operating temperature | -55 °C | -55 °C | -55 °C | -55 °C |
Package body material | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
encapsulated code | DIP | QCCN | DIP | QCCN |
Package shape | RECTANGULAR | SQUARE | RECTANGULAR | SQUARE |
Package form | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Supply voltage upper limit | 22 V | 22 V | 22 V | 22 V |
Nominal supply voltage (Vsup) | 15 V | 15 V | 15 V | 15 V |
surface mount | NO | YES | NO | YES |
Temperature level | MILITARY | MILITARY | MILITARY | MILITARY |
Terminal form | THROUGH-HOLE | NO LEAD | THROUGH-HOLE | NO LEAD |
Terminal location | DUAL | QUAD | DUAL | QUAD |
JESD-609 code | e0 | e0 | - | e0 |
Terminal surface | TIN LEAD | TIN LEAD | - | TIN LEAD |