S71GL032N80BHW0P2 datasheet, PDF

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S71GL032N80BHW0P2: DescriptionMemory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56; Categorystorage storage; File Size343KB，12 Pages; ManufacturerCypress Semiconductor

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S71GL032N80BHW0P2 Overview

Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56

S71GL032N80BHW0P2 Parametric

Parameter Name	Attribute value
package instruction	TFBGA,
Reach Compliance Code	compli
Other features	PSRAM IS ORGANIZED AS 512K X 16
JESD-30 code	R-PBGA-B56
length	9 mm
memory density	33554432 bi
Memory IC Type	MEMORY CIRCUIT
memory width	16
Number of functions	1
Number of terminals	56
word count	2097152 words
character code	2000000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-25 °C
organize	2MX16
Package body material	PLASTIC/EPOXY
encapsulated code	TFBGA
Package shape	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified
Maximum seat height	1.2 mm
Maximum supply voltage (Vsup)	3.1 V
Minimum supply voltage (Vsup)	2.7 V
Nominal supply voltage (Vsup)	3 V
surface mount	YES
technology	CMOS
Temperature level	OTHER
Terminal form	BALL
Terminal pitch	0.8 mm
Terminal location	BOTTOM
width	7 mm
Base Number Matches	1

S71GL032N80BHW0P2 Related Products

	S71GL032N80BHW0P2	S71GL032N80BFW0K2	S71GL032N80BHW0K2	S71GL032N40BHW0P0	S71GL032N40BHW0P2	S71GL032N40BHW0P3	S71GL064NB0BFW0Z2	S71GL064NB0BFW0U2	S71GL064NB0BFW0U3
Description	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56	Memory Circuit, 2MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, HALOGEN FREE, FBGA-56	Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	Memory Circuit, 4MX16, CMOS, PBGA56, 7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
package instruction	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	TFBGA,	7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56	7 X 9 MM, 1.20 MM HEIGHT, LEAD FREE, FBGA-56
Reach Compliance Code	compli	compli	compli	compli	compli	compli	compliant	compliant	compliant
Other features	PSRAM IS ORGANIZED AS 512K X 16	PSRAM IS ORGANIZED AS 512K X 16	PSRAM IS ORGANIZED AS 512K X 16	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 256K X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16	PSRAM IS ORGANIZED AS 2M X 16
JESD-30 code	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56	R-PBGA-B56
length	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm	9 mm
memory density	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	33554432 bi	67108864 bit	67108864 bit	67108864 bit
Memory IC Type	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT	MEMORY CIRCUIT
memory width	16	16	16	16	16	16	16	16	16
Number of functions	1	1	1	1	1	1	1	1	1
Number of terminals	56	56	56	56	56	56	56	56	56
word count	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	2097152 words	4194304 words	4194304 words	4194304 words
character code	2000000	2000000	2000000	2000000	2000000	2000000	4000000	4000000	4000000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C	-25 °C
organize	2MX16	2MX16	2MX16	2MX16	2MX16	2MX16	4MX16	4MX16	4MX16
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA	TFBGA
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH	GRID ARRAY, THIN PROFILE, FINE PITCH
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
Maximum supply voltage (Vsup)	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V	3.1 V
Minimum supply voltage (Vsup)	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V	2.7 V
Nominal supply voltage (Vsup)	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V	3 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER	OTHER
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm	0.8 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm	7 mm
Base Number Matches	1	1	1	1	1	1	1	1	-

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