IDT82V2088DR datasheet, PDF - EEWORLD Datasheet

IDT82V2088DR: DescriptionPCM Transceiver, 1-Func, PQFP208, PLASTIC, QFP-208; CategoryWireless rf/communication Telecom circuit; File Size1014KB，78 Pages; ManufacturerIDT (Integrated Device Technology)

Download Datasheet Parametric Compare View All

IDT82V2088DR Overview

PCM Transceiver, 1-Func, PQFP208, PLASTIC, QFP-208

Parameter Name	Attribute value
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	QFP
package instruction	PLASTIC, QFP-208
Contacts	208
Reach Compliance Code	not_compliant
JESD-30 code	S-PQFP-G208
JESD-609 code	e0
length	28 mm
Humidity sensitivity level	3
Number of functions	1
Number of terminals	208
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
Package body material	PLASTIC/EPOXY
encapsulated code	FQFP
Encapsulate equivalent code	QFP208,1.2SQ,20
Package shape	SQUARE
Package form	FLATPACK, FINE PITCH
Peak Reflow Temperature (Celsius)	225
power supply	3.3 V
Certification status	Not Qualified
Maximum seat height	4.07 mm
Maximum slew rate	0.73 mA
Nominal supply voltage	3.3 V
surface mount	YES
Telecom integrated circuit types	PCM TRANSCEIVER
Temperature level	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	GULL WING
Terminal pitch	0.5 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	20
width	28 mm

	IDT82V2088DR	IDT82V2088BB
Description	PCM Transceiver, 1-Func, PQFP208, PLASTIC, QFP-208	PCM Transceiver, 1-Func, PBGA208, PLASTIC, BGA-208
Is it lead-free?	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	QFP	BGA
package instruction	PLASTIC, QFP-208	PLASTIC, BGA-208
Contacts	208	208
Reach Compliance Code	not_compliant	not_compliant
JESD-30 code	S-PQFP-G208	S-PBGA-B208
JESD-609 code	e0	e0
length	28 mm	17 mm
Humidity sensitivity level	3	3
Number of functions	1	1
Number of terminals	208	208
Maximum operating temperature	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	FQFP	BGA
Encapsulate equivalent code	QFP208,1.2SQ,20	BGA208,16X16,40
Package shape	SQUARE	SQUARE
Package form	FLATPACK, FINE PITCH	GRID ARRAY
Peak Reflow Temperature (Celsius)	225	225
power supply	3.3 V	3.3 V
Certification status	Not Qualified	Not Qualified
Maximum seat height	4.07 mm	1.97 mm
Maximum slew rate	0.73 mA	0.73 mA
Nominal supply voltage	3.3 V	3.3 V
surface mount	YES	YES
Telecom integrated circuit types	PCM TRANSCEIVER	PCM TRANSCEIVER
Temperature level	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn63Pb37)
Terminal form	GULL WING	BALL
Terminal pitch	0.5 mm	1 mm
Terminal location	QUAD	BOTTOM
Maximum time at peak reflow temperature	20	20
width	28 mm	17 mm

Shortcut: S0 S1 S2 S3 S4 S5 S6 S7 S8 S9 SA SB SC SD SE SF SG SH SI SJ SK SL SM SN SO SP SQ SR SS ST SU SV SW SX SY SZ T0 T1 T2 T3 T4 T5 T6 T7 T8 T9 TA TB TC TD TE TF TG TH TI TJ TK TL TM TN TO TP TQ TR TS TT TU TV TW TX TY TZ U0 U1 U2 U3 U4 U6 U7 U8 UA UB UC UD UE UF UG UH UI UJ UK UL UM UN UP UQ UR US UT UU UV UW UX UZ V0 V1 V2 V3 V4 V5 V6 V7 V8 V9 VA VB VC VD VE VF VG VH VI VJ VK VL VM VN VO VP VQ VR VS VT VU VV VW VX VY VZ W0 W1 W2 W3 W4 W5 W6 W7 W8 W9 WA WB WC WD WE WF WG WH WI WJ WK WL WM WN WO WP WR WS WT WU WV WW WY X0 X1 X2 X3 X4 X5 X7 X8 X9 XA XB XC XD XE XF XG XH XK XL XM XN XO XP XQ XR XS XT XU XV XW XX XY XZ Y0 Y1 Y2 Y4 Y5 Y6 Y9 YA YB YC YD YE YF YG YH YK YL YM YN YP YQ YR YS YT YX Z0 Z1 Z2 Z3 Z4 Z5 Z6 Z8 ZA ZB ZC ZD ZE ZF ZG ZH ZJ ZL ZM ZN ZP ZR ZS ZT ZU ZV ZW ZX ZY

Popular Components