DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68
Parameter Name | Attribute value |
Is it Rohs certified? | incompatible |
Maker | Infineon |
Parts packaging code | DSBGA |
package instruction | FBGA, |
Contacts | 68 |
Reach Compliance Code | compliant |
ECCN code | EAR99 |
access mode | MULTI BANK PAGE BURST |
Maximum access time | 0.5 ns |
Other features | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B68 |
length | 20 mm |
memory density | 1073741824 bit |
Memory IC Type | DDR DRAM |
memory width | 8 |
Number of functions | 1 |
Number of ports | 1 |
Number of terminals | 68 |
word count | 134217728 words |
character code | 128000000 |
Operating mode | SYNCHRONOUS |
organize | 128MX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | FBGA |
Package shape | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
Certification status | Not Qualified |
self refresh | YES |
Maximum supply voltage (Vsup) | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V |
surface mount | YES |
technology | CMOS |
Terminal form | BALL |
Terminal pitch | 0.8 mm |
Terminal location | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 10 mm |
HYB18T1G800AC-3.7 | HYB18T1G400AC-3.7 | HYB18T1G160AC-3.7 | HYB18T1G800AC-5 | HYB18T1G160AC-5 | HYB18T1G400AC-5 | |
---|---|---|---|---|---|---|
Description | DDR DRAM, 128MX8, 0.5ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 | DDR DRAM, 256MX4, 0.5ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 | DDR DRAM, 64MX16, 0.5ns, CMOS, PBGA92, 10 X 20 MM, MO-207DL-Z, FBGA-92 | DDR DRAM, 128MX8, 0.6ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 | DDR DRAM, 64MX16, 0.6ns, CMOS, PBGA92, 10 X 20 MM, MO-207DL-Z, FBGA-92 | DDR DRAM, 256MX4, 0.6ns, CMOS, PBGA68, 10 X 20 MM, MO-207DM-Z, FBGA-68 |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
Maker | Infineon | Infineon | Infineon | Infineon | Infineon | Infineon |
Parts packaging code | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA | DSBGA |
package instruction | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, | FBGA, |
Contacts | 68 | 68 | 92 | 68 | 92 | 68 |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compli |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
access mode | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST | MULTI BANK PAGE BURST |
Maximum access time | 0.5 ns | 0.5 ns | 0.5 ns | 0.6 ns | 0.6 ns | 0.6 ns |
Other features | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH | AUTO/SELF REFRESH |
JESD-30 code | R-PBGA-B68 | R-PBGA-B68 | R-PBGA-B92 | R-PBGA-B68 | R-PBGA-B92 | R-PBGA-B68 |
length | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm | 20 mm |
memory density | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bit | 1073741824 bi |
Memory IC Type | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM | DDR DRAM |
memory width | 8 | 4 | 16 | 8 | 16 | 4 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 |
Number of ports | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 68 | 68 | 92 | 68 | 92 | 68 |
word count | 134217728 words | 268435456 words | 67108864 words | 134217728 words | 67108864 words | 268435456 words |
character code | 128000000 | 256000000 | 64000000 | 128000000 | 64000000 | 256000000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
organize | 128MX8 | 256MX4 | 64MX16 | 128MX8 | 64MX16 | 256MX4 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | FBGA | FBGA | FBGA | FBGA | FBGA | FBGA |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH | GRID ARRAY, FINE PITCH |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
self refresh | YES | YES | YES | YES | YES | YES |
Maximum supply voltage (Vsup) | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
Minimum supply voltage (Vsup) | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V | 1.7 V |
Nominal supply voltage (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
surface mount | YES | YES | YES | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Terminal form | BALL | BALL | BALL | BALL | BALL | BALL |
Terminal pitch | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
Terminal location | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
width | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm | 10 mm |