Cache SRAM Module, 256KX8, 9ns
| Parameter Name | Attribute value |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| package instruction | , |
| Reach Compliance Code | compliant |
| ECCN code | 3A991.B.2.A |
| Maximum access time | 9 ns |
| JESD-30 code | R-XSMA-N178 |
| JESD-609 code | e0 |
| memory density | 2097152 bit |
| Memory IC Type | CACHE SRAM MODULE |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 178 |
| word count | 262144 words |
| character code | 256000 |
| Operating mode | SYNCHRONOUS |
| Maximum operating temperature | 70 °C |
| Minimum operating temperature | |
| organize | 256KX8 |
| Package body material | UNSPECIFIED |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 225 |
| Certification status | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V |
| Minimum supply voltage (Vsup) | 3.14 V |
| Nominal supply voltage (Vsup) | 3.3 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD |
| Terminal location | SINGLE |
| Maximum time at peak reflow temperature | 30 |
| IDT7MPV6355S9M | IDT7MPV6355S10M | IDT7MPV6356S9M | IDT7MPV6356S10M | |
|---|---|---|---|---|
| Description | Cache SRAM Module, 256KX8, 9ns | Cache SRAM Module, 256KX8, 10ns | Cache SRAM Module, 512KX8, 9ns | Cache SRAM Module, 512KX8, 10ns |
| Reach Compliance Code | compliant | compliant | unknown | compliant |
| ECCN code | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| Maximum access time | 9 ns | 10 ns | 9 ns | 10 ns |
| JESD-30 code | R-XSMA-N178 | R-XSMA-N178 | R-XSMA-N178 | R-XSMA-N178 |
| JESD-609 code | e0 | e0 | e0 | e0 |
| memory density | 2097152 bit | 2097152 bit | 4194304 bit | 4194304 bit |
| Memory IC Type | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE | CACHE SRAM MODULE |
| memory width | 8 | 8 | 8 | 8 |
| Number of functions | 1 | 1 | 1 | 1 |
| Number of terminals | 178 | 178 | 178 | 178 |
| word count | 262144 words | 262144 words | 524288 words | 524288 words |
| character code | 256000 | 256000 | 512000 | 512000 |
| Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| Maximum operating temperature | 70 °C | 70 °C | 70 °C | 70 °C |
| organize | 256KX8 | 256KX8 | 512KX8 | 512KX8 |
| Package body material | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum supply voltage (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| Minimum supply voltage (Vsup) | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| Nominal supply voltage (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| surface mount | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS |
| Temperature level | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) |
| Terminal form | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| Terminal location | SINGLE | SINGLE | SINGLE | SINGLE |
| Is it lead-free? | Contains lead | Contains lead | - | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | - | incompatible |
| Peak Reflow Temperature (Celsius) | 225 | 225 | - | 225 |
| Maximum time at peak reflow temperature | 30 | 30 | - | 30 |
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