OTP ROM, 2KX8, 110ns, CMOS, CDFP24, CERAMIC, FP-24
| Parameter Name | Attribute value |
| Maker | Honeywell |
| Parts packaging code | DFP |
| package instruction | DFP, |
| Contacts | 24 |
| Reach Compliance Code | unknown |
| ECCN code | EAR99 |
| Maximum access time | 110 ns |
| Other features | RADIATION-HARDENED ROM |
| JESD-30 code | R-CDFP-F24 |
| length | 15.1384 mm |
| memory density | 16384 bit |
| Memory IC Type | OTP ROM |
| memory width | 8 |
| Number of functions | 1 |
| Number of terminals | 24 |
| word count | 2048 words |
| character code | 2000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 2KX8 |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DFP |
| Package shape | RECTANGULAR |
| Package form | FLATPACK |
| Parallel/Serial | PARALLEL |
| Certification status | Not Qualified |
| Maximum seat height | 3.175 mm |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | YES |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal form | FLAT |
| Terminal pitch | 1.27 mm |
| Terminal location | DUAL |
| width | 10.16 mm |
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