EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8
Parameter Name | Attribute value |
Is it lead-free? | Contains lead |
Is it Rohs certified? | incompatible |
Maker | Catalyst |
Parts packaging code | SOIC |
package instruction | SOP, SOP8,.25 |
Contacts | 8 |
Reach Compliance Code | unknown |
ECCN code | EAR99 |
Other features | 2 WIRE INTERFACE; PAGE WRITE |
Maximum clock frequency (fCLK) | 0.1 MHz |
Data retention time - minimum | 100 |
Durability | 100000 Write/Erase Cycles |
I2C control byte | 1010DMMR |
JESD-30 code | R-PDSO-G8 |
JESD-609 code | e0 |
length | 4.9 mm |
memory density | 8192 bit |
Memory IC Type | EEPROM |
memory width | 8 |
Number of functions | 1 |
Number of terminals | 8 |
word count | 1024 words |
character code | 1000 |
Operating mode | SYNCHRONOUS |
Maximum operating temperature | 70 °C |
Minimum operating temperature | |
organize | 1KX8 |
Package body material | PLASTIC/EPOXY |
encapsulated code | SOP |
Encapsulate equivalent code | SOP8,.25 |
Package shape | RECTANGULAR |
Package form | SMALL OUTLINE |
Parallel/Serial | SERIAL |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED |
power supply | 5 V |
Certification status | Not Qualified |
Maximum seat height | 1.75 mm |
Serial bus type | I2C |
Maximum standby current | 9e-7 A |
Maximum slew rate | 0.003 mA |
Maximum supply voltage (Vsup) | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V |
Nominal supply voltage (Vsup) | 5 V |
surface mount | YES |
technology | CMOS |
Temperature level | COMMERCIAL |
Terminal surface | Tin/Lead (Sn/Pb) |
Terminal form | GULL WING |
Terminal pitch | 1.27 mm |
Terminal location | DUAL |
Maximum time at peak reflow temperature | NOT SPECIFIED |
width | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms |
CAT24C08ZJ | CAT24C08ZP | CAT24C08ZJI | CAT24C08J14 | CAT24C08J14I | CAT24C08ZPI | CAT24C08J | CAT24C08JI | CAT24C08ZJ14 | |
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Description | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 | EEPROM, 1KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 | EEPROM, 1KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 1KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 |
Parts packaging code | SOIC | DIP | SOIC | SOIC | SOIC | DIP | SOIC | SOIC | SOIC |
package instruction | SOP, SOP8,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | DIP, DIP8,.3 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP14,.25 |
Contacts | 8 | 8 | 8 | 14 | 14 | 8 | 8 | 8 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN code | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
Other features | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE |
Maximum clock frequency (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
Data retention time - minimum | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
Durability | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 100000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 1000000 Write/Erase Cycles | 100000 Write/Erase Cycles |
I2C control byte | 1010DMMR | 1010DMMR | 1010DMMR | 1010DMMR | 1010DMMR | 1010DMMR | 1010DMMR | 1010DMMR | 1010DMMR |
JESD-30 code | R-PDSO-G8 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G14 | R-PDSO-G14 | R-PDIP-T8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G14 |
length | 4.9 mm | 9.27 mm | 4.9 mm | 8.65 mm | 8.65 mm | 9.27 mm | 4.9 mm | 4.9 mm | 8.65 mm |
memory density | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit | 8192 bit |
Memory IC Type | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
Number of functions | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
Number of terminals | 8 | 8 | 8 | 14 | 14 | 8 | 8 | 8 | 14 |
word count | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words | 1024 words |
character code | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 | 1000 |
Operating mode | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
Maximum operating temperature | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 85 °C | 70 °C |
organize | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 | 1KX8 |
Package body material | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
encapsulated code | SOP | DIP | SOP | SOP | SOP | DIP | SOP | SOP | SOP |
Encapsulate equivalent code | SOP8,.25 | DIP8,.3 | SOP8,.25 | SOP14,.25 | SOP14,.25 | DIP8,.3 | SOP8,.25 | SOP8,.25 | SOP14,.25 |
Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
Package form | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
Parallel/Serial | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
power supply | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
Maximum seat height | 1.75 mm | 4.57 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.57 mm | 1.75 mm | 1.75 mm | 1.75 mm |
Serial bus type | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
Maximum standby current | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A |
Maximum slew rate | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
Maximum supply voltage (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
Minimum supply voltage (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
Nominal supply voltage (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
surface mount | YES | NO | YES | YES | YES | NO | YES | YES | YES |
technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
Temperature level | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
Terminal form | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | THROUGH-HOLE | GULL WING | GULL WING | GULL WING |
Terminal pitch | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm |
Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
width | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm |
Maximum write cycle time (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | - | Contains lead | Contains lead |
Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | - | incompatible | incompatible |
Maker | Catalyst | - | - | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | - | e0 | e0 |
Peak Reflow Temperature (Celsius) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |
Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
Maximum time at peak reflow temperature | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED |