SB-64, Tube
| Parameter Name | Attribute value |
| Brand Name | Integrated Device Technology |
| Is it lead-free? | Contains lead |
| Is it Rohs certified? | incompatible |
| Maker | IDT (Integrated Device Technology) |
| Parts packaging code | SB |
| package instruction | DIP, DIP64,.6 |
| Contacts | 64 |
| Manufacturer packaging code | SB64 |
| Reach Compliance Code | not_compliant |
| Maximum access time | 80 ns |
| I/O type | COMMON |
| JESD-30 code | R-CDMA-T64 |
| JESD-609 code | e0 |
| length | 81.28 mm |
| memory density | 1048576 bit |
| Memory IC Type | DUAL-PORT SRAM |
| memory width | 8 |
| Humidity sensitivity level | 1 |
| Number of functions | 1 |
| Number of ports | 2 |
| Number of terminals | 64 |
| word count | 131072 words |
| character code | 128000 |
| Operating mode | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C |
| Minimum operating temperature | -55 °C |
| organize | 128KX8 |
| Output characteristics | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP |
| Encapsulate equivalent code | DIP64,.6 |
| Package shape | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 |
| power supply | 5 V |
| Certification status | Not Qualified |
| Filter level | MIL-STD-883 Class B |
| Maximum seat height | 9.652 mm |
| Maximum standby current | 0.245 A |
| Minimum standby current | 4.5 V |
| Maximum slew rate | 1.13 mA |
| Maximum supply voltage (Vsup) | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V |
| surface mount | NO |
| technology | CMOS |
| Temperature level | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE |
| Terminal pitch | 2.54 mm |
| Terminal location | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED |
| width | 15.24 mm |
| 7M1001S80CB | IDT7M1001S30CB | IDT7M1003S30CB | 7M1003S50C | 7M1003S65C | 7M1003S80CB | 7M1003S65CB | 7M1001S65C | 7M1001S50C | 7M1001S65CB | |
|---|---|---|---|---|---|---|---|---|---|---|
| Description | SB-64, Tube | Multi-Port SRAM Module, 128KX8, 30ns, CMOS, CDIP64 | Multi-Port SRAM Module, 64KX8, 30ns, CMOS, CDIP64 | SB-64, Tube | SB-64, Tube | SB-64, Tube | SB-64, Tube | SB-64, Tube | SB-64, Tube | SB-64, Tube |
| Is it lead-free? | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead | Contains lead |
| Is it Rohs certified? | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible | incompatible |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| Maximum access time | 80 ns | 30 ns | 30 ns | 50 ns | 65 ns | 80 ns | 65 ns | 65 ns | 50 ns | 65 ns |
| I/O type | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 code | R-CDMA-T64 | R-XDIP-T64 | R-XDIP-T64 | R-CDMA-T64 | R-CDMA-T64 | R-CDMA-T64 | R-CDMA-T64 | R-CDMA-T64 | R-CDMA-T64 | R-CDMA-T64 |
| JESD-609 code | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| memory density | 1048576 bit | 1048576 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 524288 bit | 1048576 bit | 1048576 bit | 1048576 bit |
| Memory IC Type | DUAL-PORT SRAM | MULTI-PORT SRAM MODULE | MULTI-PORT SRAM MODULE | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| memory width | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| Number of ports | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| Number of terminals | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| word count | 131072 words | 131072 words | 65536 words | 65536 words | 65536 words | 65536 words | 65536 words | 131072 words | 131072 words | 131072 words |
| character code | 128000 | 128000 | 64000 | 64000 | 64000 | 64000 | 64000 | 128000 | 128000 | 128000 |
| Operating mode | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| Maximum operating temperature | 125 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
| Minimum operating temperature | -55 °C | -55 °C | -55 °C | - | - | -55 °C | -55 °C | - | - | -55 °C |
| organize | 128KX8 | 128KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 64KX8 | 128KX8 | 128KX8 | 128KX8 |
| Output characteristics | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| Package body material | CERAMIC, METAL-SEALED COFIRED | CERAMIC | CERAMIC | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
| encapsulated code | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
| Encapsulate equivalent code | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 | DIP64,.6 |
| Package shape | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| Package form | MICROELECTRONIC ASSEMBLY | IN-LINE | IN-LINE | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| Parallel/Serial | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| Peak Reflow Temperature (Celsius) | 260 | 225 | 225 | 260 | 260 | 260 | 260 | 260 | 260 | 260 |
| Certification status | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| Maximum standby current | 0.245 A | 0.245 A | 0.125 A | 0.065 A | 0.065 A | 0.125 A | 0.125 A | 0.125 A | 0.125 A | 0.245 A |
| Minimum standby current | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Maximum slew rate | 1.13 mA | 1.13 mA | 0.79 mA | 0.66 mA | 0.66 mA | 0.79 mA | 0.79 mA | 0.94 mA | 0.94 mA | 1.13 mA |
| surface mount | NO | NO | NO | NO | NO | NO | NO | NO | NO | NO |
| technology | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| Temperature level | MILITARY | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
| Terminal surface | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| Terminal form | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| Terminal pitch | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| Terminal location | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| Maximum time at peak reflow temperature | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| Brand Name | Integrated Device Technology | - | - | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology | Integrated Device Technology |
| Maker | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| Parts packaging code | SB | - | - | SB | SB | SB | SB | SB | SB | SB |
| package instruction | DIP, DIP64,.6 | - | - | CERAMIC, SIDEBRAZED, DIP-64 | CERAMIC, SIDEBRAZED, DIP-64 | DIP, DIP64,.6 | DIP, DIP64,.6 | CERAMIC, SIDEBRAZED, DIP-64 | CERAMIC, SIDEBRAZED, DIP-64 | DIP, DIP64,.6 |
| Contacts | 64 | - | - | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
| Manufacturer packaging code | SB64 | - | - | SB64 | SB64 | SB64 | SB64 | SB64 | SB64 | SB64 |
| length | 81.28 mm | - | - | 81.28 mm | 81.28 mm | 81.28 mm | 81.28 mm | 81.28 mm | 81.28 mm | 81.28 mm |
| Humidity sensitivity level | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Number of functions | 1 | - | - | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| Filter level | MIL-STD-883 Class B | MIL-STD-883 Class B (Modified) | MIL-STD-883 Class B (Modified) | - | - | MIL-STD-883 Class B | MIL-STD-883 Class B | - | - | MIL-STD-883 Class B |
| Maximum seat height | 9.652 mm | - | - | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm | 9.652 mm |
| Maximum supply voltage (Vsup) | 5.5 V | - | - | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| Minimum supply voltage (Vsup) | 4.5 V | - | - | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| Nominal supply voltage (Vsup) | 5 V | 5 V | - | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| width | 15.24 mm | - | - | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm | 15.24 mm |
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