7M1002S55G datasheet, PDF - EEWORLD Datasheet

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7M1002S55G: DescriptionPGA-121, Box; Categorystorage storage; File Size713KB，14 Pages; ManufacturerIDT (Integrated Device Technology)

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7M1002S55G Overview

PGA-121, Box

7M1002S55G Parametric

Parameter Name	Attribute value
Brand Name	Integrated Device Technology
Is it lead-free?	Contains lead
Is it Rohs certified?	incompatible
Maker	IDT (Integrated Device Technology)
Parts packaging code	PGA
package instruction	PGA, PGA121,13X13
Contacts	121
Manufacturer packaging code	GU121
Reach Compliance Code	not_compliant
Maximum access time	55 ns
I/O type	COMMON
JESD-30 code	S-CPGA-P121
JESD-609 code	e0
length	34.036 mm
memory density	524288 bit
Memory IC Type	DUAL-PORT SRAM
memory width	32
Humidity sensitivity level	1
Number of functions	1
Number of ports	2
Number of terminals	121
word count	16384 words
character code	16000
Operating mode	ASYNCHRONOUS
Maximum operating temperature	70 °C
Minimum operating temperature
organize	16KX32
Output characteristics	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA
Encapsulate equivalent code	PGA121,13X13
Package shape	SQUARE
Package form	GRID ARRAY
Parallel/Serial	PARALLEL
Peak Reflow Temperature (Celsius)	260
power supply	5 V
Certification status	Not Qualified
Maximum seat height	5.969 mm
Maximum standby current	0.06 A
Minimum standby current	4.5 V
Maximum slew rate	1.36 mA
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	4.5 V
Nominal supply voltage (Vsup)	5 V
surface mount	NO
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG
Terminal pitch	2.54 mm
Terminal location	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED
width	34.036 mm

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7M1002S55G Related Products

	7M1002S55G	7M1002S40G	7M1002S65G	7M1002S45G	7M1002S35GB
Description	PGA-121, Box	PGA-121, Box	PGA-121, Box	PGA-121, Box	PGA-121, Box
Brand Name	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology	Integrated Device Technology
Is it lead-free?	Contains lead	Contains lead	Contains lead	Contains lead	Contains lead
Is it Rohs certified?	incompatible	incompatible	incompatible	incompatible	incompatible
Maker	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
Parts packaging code	PGA	PGA	PGA	PGA	PGA
package instruction	PGA, PGA121,13X13	PGA, PGA121,13X13	PGA, PGA121,13X13	PGA, PGA121,13X13	PGA, PGA121,13X13
Contacts	121	121	121	121	121
Manufacturer packaging code	GU121	GU121	GU121	GU121	GU121
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
Maximum access time	55 ns	40 ns	65 ns	45 ns	35 ns
I/O type	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 code	S-CPGA-P121	S-CPGA-P121	S-CPGA-P121	S-CPGA-P121	S-CPGA-P121
JESD-609 code	e0	e0	e0	e0	e0
length	34.036 mm	34.036 mm	34.036 mm	34.036 mm	34.036 mm
memory density	524288 bit	524288 bit	524288 bit	524288 bit	524288 bit
Memory IC Type	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
memory width	32	32	32	32	32
Humidity sensitivity level	1	1	1	1	1
Number of functions	1	1	1	1	1
Number of ports	2	2	2	2	2
Number of terminals	121	121	121	121	121
word count	16384 words	16384 words	16384 words	16384 words	16384 words
character code	16000	16000	16000	16000	16000
Operating mode	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
Maximum operating temperature	70 °C	70 °C	70 °C	70 °C	125 °C
organize	16KX32	16KX32	16KX32	16KX32	16KX32
Output characteristics	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	PGA	PGA	PGA	PGA	PGA
Encapsulate equivalent code	PGA121,13X13	PGA121,13X13	PGA121,13X13	PGA121,13X13	PGA121,13X13
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Parallel/Serial	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
Peak Reflow Temperature (Celsius)	260	260	260	260	260
power supply	5 V	5 V	5 V	5 V	5 V
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	5.969 mm	5.969 mm	5.969 mm	5.969 mm	5.969 mm
Maximum standby current	0.06 A	0.06 A	0.06 A	0.06 A	0.12 A
Minimum standby current	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Maximum slew rate	1.36 mA	1.36 mA	1.36 mA	1.36 mA	1.6 mA
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
Nominal supply voltage (Vsup)	5 V	5 V	5 V	5 V	5 V
surface mount	NO	NO	NO	NO	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	MILITARY
Terminal surface	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
Terminal form	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG	PIN/PEG
Terminal pitch	2.54 mm	2.54 mm	2.54 mm	2.54 mm	2.54 mm
Terminal location	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR	PERPENDICULAR
Maximum time at peak reflow temperature	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
width	34.036 mm	34.036 mm	34.036 mm	34.036 mm	34.036 mm

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