IS24C02B-2CLI datasheet, PDF - EEWORLD Datasheet

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IS24C02B-2CLI: DescriptionEEPROM, 256X8, Serial, CMOS, GREEN, CSP-8; Categorystorage storage; File Size341KB，20 Pages; ManufacturerIntegrated Silicon Solution ( ISSI ); Environmental Compliance

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IS24C02B-2CLI Overview

EEPROM, 256X8, Serial, CMOS, GREEN, CSP-8

IS24C02B-2CLI Parametric

Parameter Name	Attribute value
Is it lead-free?	Lead free
Is it Rohs certified?	conform to
Maker	Integrated Silicon Solution ( ISSI )
Parts packaging code	CSP
package instruction	DIE,
Contacts	8
Reach Compliance Code	compliant
ECCN code	EAR99
Maximum clock frequency (fCLK)	0.4 MHz
JESD-30 code	R-XUUC-N8
JESD-609 code	e1
memory density	2048 bit
Memory IC Type	EEPROM
memory width	8
Number of functions	1
Number of terminals	8
word count	256 words
character code	256
Operating mode	SYNCHRONOUS
Maximum operating temperature	85 °C
Minimum operating temperature	-40 °C
organize	256X8
Package body material	UNSPECIFIED
encapsulated code	DIE
Package shape	RECTANGULAR
Package form	UNCASED CHIP
Parallel/Serial	SERIAL
Peak Reflow Temperature (Celsius)	260
Certification status	Not Qualified
Serial bus type	I2C
Maximum supply voltage (Vsup)	5.5 V
Minimum supply voltage (Vsup)	1.8 V
Nominal supply voltage (Vsup)	2.5 V
surface mount	YES
technology	CMOS
Temperature level	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)
Terminal form	NO LEAD
Terminal location	UPPER
Maximum time at peak reflow temperature	40
Maximum write cycle time (tWC)	5 ms

IS24C02B-2CLI Related Products

	IS24C02B-2CLI	IS24C02B-2GLI	IS24C02B-2ZLI	IS24C01B-2CLI	IS24C02B-2PLI
Description	EEPROM, 256X8, Serial, CMOS, GREEN, CSP-8	EEPROM, 256X8, Serial, CMOS, PDSO8, 0.150 INCH, GREEN, SOIC-8	EEPROM, 256X8, Serial, CMOS, PDSO8, 3 X 4.40 MM, GREEN, MO-153, TSSOP-8	EEPROM, 128X8, Serial, CMOS, GREEN, CSP-8	EEPROM, 256X8, Serial, CMOS, PDIP8, 0.300 INCH, GREEN, PLASTIC, DIP-8
Is it lead-free?	Lead free	Lead free	Lead free	Lead free	Lead free
Is it Rohs certified?	conform to	conform to	conform to	conform to	conform to
Maker	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )	Integrated Silicon Solution ( ISSI )
Parts packaging code	CSP	SOIC	TSSOP	CSP	DIP
package instruction	DIE,	SOP, SOP8,.25	TSSOP, TSSOP8,.25	DIE,	DIP, DIP8,.3
Contacts	8	8	8	8	8
Reach Compliance Code	compliant	compliant	compliant	compliant	compliant
ECCN code	EAR99	EAR99	EAR99	EAR99	EAR99
Maximum clock frequency (fCLK)	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz	0.4 MHz
JESD-30 code	R-XUUC-N8	R-PDSO-G8	R-PDSO-G8	R-XUUC-N8	R-PDIP-T8
JESD-609 code	e1	e3	e3	e1	e3
memory density	2048 bit	2048 bit	2048 bit	1024 bit	2048 bit
Memory IC Type	EEPROM	EEPROM	EEPROM	EEPROM	EEPROM
memory width	8	8	8	8	8
Number of functions	1	1	1	1	1
Number of terminals	8	8	8	8	8
word count	256 words	256 words	256 words	128 words	256 words
character code	256	256	256	128	256
Operating mode	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS	SYNCHRONOUS
Maximum operating temperature	85 °C	85 °C	85 °C	85 °C	85 °C
Minimum operating temperature	-40 °C	-40 °C	-40 °C	-40 °C	-40 °C
organize	256X8	256X8	256X8	128X8	256X8
Package body material	UNSPECIFIED	PLASTIC/EPOXY	PLASTIC/EPOXY	UNSPECIFIED	PLASTIC/EPOXY
encapsulated code	DIE	SOP	TSSOP	DIE	DIP
Package shape	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
Package form	UNCASED CHIP	SMALL OUTLINE	SMALL OUTLINE, THIN PROFILE, SHRINK PITCH	UNCASED CHIP	IN-LINE
Parallel/Serial	SERIAL	SERIAL	SERIAL	SERIAL	SERIAL
Peak Reflow Temperature (Celsius)	260	260	260	260	260
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Serial bus type	I2C	I2C	I2C	I2C	I2C
Maximum supply voltage (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
Minimum supply voltage (Vsup)	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage (Vsup)	2.5 V	2.5 V	2.5 V	2.5 V	2.5 V
surface mount	YES	YES	YES	YES	NO
technology	CMOS	CMOS	CMOS	CMOS	CMOS
Temperature level	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL	INDUSTRIAL
Terminal surface	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn) - annealed	Matte Tin (Sn) - annealed	Tin/Silver/Copper (Sn/Ag/Cu)	Matte Tin (Sn) - annealed
Terminal form	NO LEAD	GULL WING	GULL WING	NO LEAD	THROUGH-HOLE
Terminal location	UPPER	DUAL	DUAL	UPPER	DUAL
Maximum time at peak reflow temperature	40	10	40	40	40
Maximum write cycle time (tWC)	5 ms	5 ms	5 ms	5 ms	5 ms
Data retention time - minimum	-	100	100	-	100
Durability	-	1000000 Write/Erase Cycles	1000000 Write/Erase Cycles	-	1000000 Write/Erase Cycles
I2C control byte	-	1010DDDR	1010DDDR	-	1010DDDR
length	-	4.9 mm	4.4 mm	-	9.325 mm
Humidity sensitivity level	-	1	1	-	3
Encapsulate equivalent code	-	SOP8,.25	TSSOP8,.25	-	DIP8,.3
power supply	-	2/5 V	2/5 V	-	2/5 V
Maximum seat height	-	1.75 mm	1.2 mm	-	4.57 mm
Maximum standby current	-	0.000001 A	0.000001 A	-	0.000001 A
Maximum slew rate	-	0.003 mA	0.003 mA	-	0.003 mA
Terminal pitch	-	1.27 mm	0.65 mm	-	2.54 mm
width	-	3.9 mm	3 mm	-	7.62 mm
write protect	-	HARDWARE	HARDWARE	-	HARDWARE

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