IBM25PPC604E3DB--300E datasheet, PDF

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IBM25PPC604E3DB--300E: DescriptionRISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255; CategoryThe embedded processor and controller Microcontrollers and processors; File Size544KB，29 Pages; ManufacturerIBM; Websitehttp://www.ibm.com

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IBM25PPC604E3DB--300E Overview

RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255

IBM25PPC604E3DB--300E Parametric

Parameter Name	Attribute value
Maker	IBM
Parts packaging code	BGA
package instruction	BGA,
Contacts	255
Reach Compliance Code	unknown
ECCN code	3A001.A.3
Address bus width	32
bit size	32
boundary scan	YES
maximum clock frequency	100 MHz
External data bus width	64
Format	FLOATING POINT
Integrated cache	YES
JESD-30 code	S-CBGA-B255
length	21 mm
low power mode	YES
Number of terminals	255
Package body material	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA
Package shape	SQUARE
Package form	GRID ARRAY
Certification status	Not Qualified
Maximum seat height	3.3 mm
speed	300 MHz
Maximum supply voltage	2 V
Minimum supply voltage	1.8 V
Nominal supply voltage	1.9 V
surface mount	YES
technology	CMOS
Terminal form	BALL
Terminal pitch	1.27 mm
Terminal location	BOTTOM
width	21 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC

IBM25PPC604E3DB--300E Related Products

	IBM25PPC604E3DB--300E	IBM25PPC604E3DB--333E	IBM25PPC604E3BB--300E	IBM25PPC604E3BB--333E	IBM25PPC604E3BB--350E	IBM25PPC604E3BB--250E	IBM25PPC604E3DB--250E	IBM25PPC604E3DB--350E
Description	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 250MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 250MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255	RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
Maker	IBM	IBM	IBM	IBM	IBM	IBM	IBM	IBM
Parts packaging code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
package instruction	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,	BGA,
Contacts	255	255	255	255	255	255	255	255
Reach Compliance Code	unknown	unknown	unknown	unknown	unknow	unknow	unknow	unknow
ECCN code	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3	3A001.A.3
Address bus width	32	32	32	32	32	32	32	32
bit size	32	32	32	32	32	32	32	32
boundary scan	YES	YES	YES	YES	YES	YES	YES	YES
maximum clock frequency	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz	100 MHz
External data bus width	64	64	64	64	64	64	64	64
Format	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT	FLOATING POINT
Integrated cache	YES	YES	YES	YES	YES	YES	YES	YES
JESD-30 code	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255	S-CBGA-B255
length	21 mm	21 mm	21 mm	21 mm	21 mm	21 mm	21 mm	21 mm
low power mode	YES	YES	YES	YES	YES	YES	YES	YES
Number of terminals	255	255	255	255	255	255	255	255
Package body material	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED	CERAMIC, METAL-SEALED COFIRED
encapsulated code	BGA	BGA	BGA	BGA	BGA	BGA	BGA	BGA
Package shape	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
Package form	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY	GRID ARRAY
Certification status	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
Maximum seat height	3.3 mm	3.3 mm	3.3 mm	3.3 mm	3.3 mm	3.3 mm	3.3 mm	3.3 mm
speed	300 MHz	333 MHz	300 MHz	333 MHz	350 MHz	250 MHz	250 MHz	350 MHz
Maximum supply voltage	2 V	2 V	2 V	2 V	2 V	2 V	2 V	2 V
Minimum supply voltage	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V	1.8 V
Nominal supply voltage	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V	1.9 V
surface mount	YES	YES	YES	YES	YES	YES	YES	YES
technology	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
Terminal form	BALL	BALL	BALL	BALL	BALL	BALL	BALL	BALL
Terminal pitch	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm
Terminal location	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM	BOTTOM
width	21 mm	21 mm	21 mm	21 mm	21 mm	21 mm	21 mm	21 mm
uPs/uCs/peripheral integrated circuit type	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC	MICROPROCESSOR, RISC

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