W77LE532P-25 datasheet, PDF - EEWORLD Datasheet

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W77LE532P-25: DescriptionMicrocontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PQCC44, PLASTIC, LCC-44; CategoryThe embedded processor and controller Microcontrollers and processors; File Size738KB，85 Pages; ManufacturerWinbond Electronics Corporation; Websitehttp://www.winbond.com.tw

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W77LE532P-25 Overview

Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PQCC44, PLASTIC, LCC-44

W77LE532P-25 Parametric

Parameter Name	Attribute value
Is it Rohs certified?	incompatible
Maker	Winbond Electronics Corporation
Parts packaging code	LCC
package instruction	PLASTIC, LCC-44
Contacts	44
Reach Compliance Code	unknown
Has ADC	NO
Address bus width	16
bit size	8
CPU series	8051
maximum clock frequency	25 MHz
DAC channel	NO
DMA channel	NO
External data bus width	8
JESD-30 code	S-PQCC-J44
JESD-609 code	e0
length	16.59 mm
Number of I/O lines	36
Number of terminals	44
Maximum operating temperature	70 °C
Minimum operating temperature
PWM channel	NO
Package body material	PLASTIC/EPOXY
encapsulated code	QCCJ
Encapsulate equivalent code	LDCC44,.7SQ
Package shape	SQUARE
Package form	CHIP CARRIER
Peak Reflow Temperature (Celsius)	225
power supply	3/5 V
Certification status	Not Qualified
RAM (bytes)	256
rom(word)	65536
ROM programmability	FLASH
Maximum seat height	4.699 mm
speed	25 MHz
Maximum slew rate	30 mA
Maximum supply voltage	5.5 V
Minimum supply voltage	2.7 V
Nominal supply voltage	4.5 V
surface mount	YES
technology	CMOS
Temperature level	COMMERCIAL
Terminal surface	TIN LEAD
Terminal form	J BEND
Terminal pitch	1.27 mm
Terminal location	QUAD
Maximum time at peak reflow temperature	30
width	16.59 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER

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Preliminary W77LE532

8-BIT MICROCONTROLLER

Table of Contents-

10.

11.

12.

13.

14.

15.

GENERAL DESCRIPTION .................................................................................................................. 2

FEATURES ......................................................................................................................................... 2

PIN CONFIGURATIONS ..................................................................................................................... 3

PIN DESCRIPTION ............................................................................................................................. 4

BLOCK DIAGRAM............................................................................................................................... 6

FUNCTIONAL DESCRIPTION ............................................................................................................ 7

MEMORY ORGANIZATION ................................................................................................................ 8

INSTRUCTION .................................................................................................................................. 33

INSTRUCTION TIMING .................................................................................................................... 33

POWER MANAGEMENT .................................................................................................................. 41

RESET CONDITIONS ....................................................................................................................... 43

RESET STATE .................................................................................................................................. 44

PROGRAMMABLE TIMERS/COUNTERS ........................................................................................ 48

TIMED ACCESS PROTECTION ....................................................................................................... 63

IN-SYSTEM PROGRAMMING .......................................................................................................... 66

15.1

15.2

The Loader Program locates at LDFLASH memory. .................................................................. 66

The Loader Program locates at APFLASH memory. .................................................................. 66

16.

17.

18.

ON-CHIP FLASH EPROM CHARACTERISTICS.............................................................................. 66

SECURITY BITS................................................................................................................................ 69

ELECTRICAL CHARACTERISTIC .................................................................................................... 70

18.1

18.2

18.3

Absolute Maximum Ratings ........................................................................................................ 70

DC Characteristics...................................................................................................................... 70

AC Characteristics...................................................................................................................... 72

Expanded External Program Memory and Crystal...................................................................... 77

Expanded External Data Memory and Oscillator ........................................................................ 78

40-pin DIP .................................................................................................................................. 78

44-pin PLCC............................................................................................................................... 79

44-pin QFP ................................................................................................................................. 79

In-system Programming Software Examples.............................................................................. 80

19.

TYPICAL APPLICATION CIRCUITS ................................................................................................. 77

19.1

19.2

20.

PACKAGE DIMENSIONS.................................................................................................................. 78

20.1

20.2

20.3

21.

22.

APPLICATION NOTE ........................................................................................................................ 80

21.1

REVISION HISTORY......................................................................................................................... 85

-1-

Publication Release Date: May 14, 2003

Revision A1

W77LE532P-25 Related Products

	W77LE532P-25	W77LE532F-25	W77LE532-25
Description	Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PQCC44, PLASTIC, LCC-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PQFP44, QFP-44	Microcontroller, 8-Bit, FLASH, 8051 CPU, 25MHz, CMOS, PDIP40, DIP-40
Is it Rohs certified?	incompatible	incompatible	incompatible
Maker	Winbond Electronics Corporation	Winbond Electronics Corporation	Winbond Electronics Corporation
Parts packaging code	LCC	QFP	DIP
package instruction	PLASTIC, LCC-44	QFP-44	DIP-40
Contacts	44	44	40
Reach Compliance Code	unknown	unknown	unknown
Has ADC	NO	NO	NO
Address bus width	16	16	16
bit size	8	8	8
CPU series	8051	8051	8051
maximum clock frequency	25 MHz	25 MHz	25 MHz
DAC channel	NO	NO	NO
DMA channel	NO	NO	NO
External data bus width	8	8	8
JESD-30 code	S-PQCC-J44	S-PQFP-G44	R-PDIP-T40
JESD-609 code	e0	e0	e0
length	16.59 mm	10 mm	52.2 mm
Number of I/O lines	36	36	32
Number of terminals	44	44	40
Maximum operating temperature	70 °C	70 °C	70 °C
PWM channel	NO	NO	NO
Package body material	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
encapsulated code	QCCJ	QFP	DIP
Encapsulate equivalent code	LDCC44,.7SQ	QFP44,.52SQ,32	DIP40,.6
Package shape	SQUARE	SQUARE	RECTANGULAR
Package form	CHIP CARRIER	FLATPACK	IN-LINE
Peak Reflow Temperature (Celsius)	225	NOT SPECIFIED	NOT SPECIFIED
power supply	3/5 V	3/5 V	3/5 V
Certification status	Not Qualified	Not Qualified	Not Qualified
RAM (bytes)	256	256	256
rom(word)	65536	65536	65536
ROM programmability	FLASH	FLASH	FLASH
Maximum seat height	4.699 mm	2.7 mm	5.334 mm
speed	25 MHz	25 MHz	25 MHz
Maximum slew rate	30 mA	30 mA	30 mA
Maximum supply voltage	5.5 V	5.5 V	5.5 V
Minimum supply voltage	2.7 V	2.7 V	2.7 V
Nominal supply voltage	4.5 V	4.5 V	4.5 V
surface mount	YES	YES	NO
technology	CMOS	CMOS	CMOS
Temperature level	COMMERCIAL	COMMERCIAL	COMMERCIAL
Terminal surface	TIN LEAD	TIN LEAD	TIN LEAD
Terminal form	J BEND	GULL WING	THROUGH-HOLE
Terminal pitch	1.27 mm	0.8 mm	2.54 mm
Terminal location	QUAD	QUAD	DUAL
Maximum time at peak reflow temperature	30	NOT SPECIFIED	NOT SPECIFIED
width	16.59 mm	10 mm	15.24 mm
uPs/uCs/peripheral integrated circuit type	MICROCONTROLLER	MICROCONTROLLER	MICROCONTROLLER

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